Heard on the Beat: AMD-ST to merge memory units?
EE Times: Heard on the Beat: AMD-ST to merge memory units? | |
(06/06/2005 10:11 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=164300540 | |
The "buzz" among financial analysts is that Advanced Micro Devices Inc. and STMicroelectronics Inc. could possibly combine their respective and trouble memory operations in a mega venture. One analyst said that "it is possible" that AMD and ST would reportedly combine their memory operations even though there is no word if the two companies are actually talking. Another analyst said that it makes no sense that AMD and ST would combine their operations, given the problems with their respective units. In April, Spansion LLC, the flash memory venture of AMD and Fujitsu, filed for an IPO, likely indicating AMD is jettisoning its unprofitable memory unit. With the flash memory market plagued by a capacity glut and falling prices, memory suppliers have undergone rough sledding in recent months, Spansion being no exception. Analysts have called for AMD to focus on its growing microprocessor business by withdrawing its stake in the venture. AMD owns 60 percent of Spansion (see April 13 story).
At the same time, STMicroelectronics NV is considering selling its memory business, according to reports (see May 24 story). A newsletter from Semico Research Corp. refers to the Wall Street Journal stating that ST is considering selling its memory business. The newsletter goes on to observe that with Intel taking flash memory market share from ST in set-top boxes and the overall NOR market going into decline, the memory group at ST appears a reasonable target for a cut.
| |
- - | |
Related Semiconductor IP
- RISC-V CPU IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
Related News
- Toshiba, Fujitsu to develop SoCs, but 'may' merge units
- Heard on the Beat: new chairman named at FSA
- NEC merges process, SoC units
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers