IBM, Samsung Unveil VTFET to Extend Moore's Law
By Stefani Munoz, EETimes (December 14, 2021)
IBM and Samsung Electronics claimed a breakthrough in semiconductor design based on a new IBM’s architecture touted as enabling an 85-percent reduction in power consumption.
The partners said the Vertical Transport Field-Effect Transistors (VTFET) scheme offers greater power efficiency over FinFET designs, potentially extending Moore’s Law scaling beyond current two-dimensional nanosheet thresholds.
FinFETs are generally designed to lie flat atop a wafer to allow electric currents to flow horizontally. Compared to a planar transistor, FinFETs help reduce power leakage while providing greater device density.
Unlike FinFETs, the companies said VTFETs are situated perpendicular to a chip substrate, allowing electric currents to flow vertically. The companies claim the design could, for example, extend smartphone battery life beyond a week without requiring a charge, according to IBM’s blog post.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- Parameterizable compact BCH codec
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
Related News
- Moore Microprocessor Portfolio (MMP) Inventor Files Lawsuit against TPL Group
- Moore's Law could enter the fourth dimension--via the third
- Moore's Law threatened by lithography woes
- Broadcom: Time to prepare for the end of Moore's Law
Latest News
- ISOLDE Project Demonstrates Advancements in European Open-Source RISC-V for Automotive, Space, and IoT
- ACL Digital and AIM FUTURE Partner to Drive Innovation in Edge AI
- Tenstorrent and PwC Partner to Advance AI Ecosystem Development in Cyprus
- Republic of Cyprus Selects Tenstorrent for AI Innovation
- SiFive and IAR Collaborate to Advance the Automotive Ecosystem and Drive RISC-V Innovation in Automotive Electronics