How Arm Total Design is built around 5 key building blocks
By Majeed Ahmad, EDN (October 19, 2023)
The ecosystem has been Arm’s key strength and is evident from its latest initiative: Arm Total Design. After unveiling the Neoverse Compute Subsystems (CSS)—high-end cores for infrastructure applications like AI, cloud, data center, and networking applications—the Cambridge, UK-based IP house has followed up with a full-fledged semiconductor design ecosystem.
The ecosystem covers all stages of silicon development. That’s critical for Arm while it competes with a well-entrenched x86 processor ecosystem for infrastructure and data center chips. So, Arm is striving to facilitate an industry-wide alignment on the fundamental interfaces and system architectures to cost-effectively enable custom silicon around system-on-chip (SoC) and multi-die chiplet designs.
To read the full article, click here
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- ADTechnology is accelerating its performance and targeting infrastructure markets by joining Arm Total Design.
- MediaTek Joins Arm Total Design to Shape the Future of AI Computing
- SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform
- Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale