Credo Joins Arm Total Design to Accelerate the Development of Custom Silicon for AI Data Centers

Participation in Ecosystem Combines Arm’s World-Class Processing Capabilities with Credo’s Leading-Edge Connectivity IP to Enable Optimized Semiconductor Solutions

SAN JOSE, Calif.-- October 14, 2025 -- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency, today announced it has joined the Arm® Total Design ecosystem. By joining Arm Total Design, Credo brings its industry-leading, high-speed SerDes and mixed-signal DSP IP portfolio including its SerDes chiplets to the ecosystem. The combination of Credo IP and chiplets with Arm’s processor architecture allows customers to rapidly design innovative silicon solutions for next-generation AI, cloud computing and hyperscale data center applications.

Arm Total Design enables Credo’s customers to collaborate with industry partners to accelerate and simplify the development of custom silicon based on Arm Neoverse™ Compute Subsystems (CSS). Credo joins a multivendor, Arm-based chiplet ecosystem that benefits customers building high-performance, low-power infrastructure for the data centers of the future. Arm Neoverse CSS is synergistic with Credo’s SerDes IP and chiplets, enabling the essential high-speed connectivity and processing building blocks to quickly bring to market optimized solutions for the AI era.

“As AI workloads continue to evolve and compute demands increase, the industry needs easier ways to work together to deliver specialized solutions,” said Eddie Ramirez, vice president of go-to-market, Infrastructure Business, Arm. “Credo’s leadership in high-speed connectivity and chiplet innovation is a great fit for the Arm Total Design ecosystem and will help our mutual partners accelerate their path toward scalable, efficient AI systems.”

“Arm Total Design demonstrates Arm’s leadership in addressing the evolving challenges that the industry faces in bringing cutting-edge semiconductor technologies to market quickly,” said Jeff Twombly, vice president of business development, Credo. “Joining the Arm Total Design ecosystem reinforces our commitment to work together with industry partners to advance the core technologies driving energy-efficient and highly-reliable connectivity for massive, data-intensive AI workloads.”

Credo’s high-performance, energy-efficient IP portfolio is designed for easy integration and offered for customer-specific ASIC designs and as chiplets for integration into Multichip Module System on Chip (MCM SoC) and 2.5D Silicon Interposer designs. Credo’s comprehensive SerDes IP family includes a wide range of signaling options that span 28G to 224G and reach options that include long reach plus (LR+), long reach (LR), medium reach (MR), and very short reach plus (VSR).

About Credo

Credo’s mission is to redefine high-speed connectivity by delivering breakthrough solutions that enable the next generation of AI-driven applications. We are committed to enabling faster, more reliable, more energy-efficient, and scalable solutions that support the ever-expanding demands of AI, cloud computing, and hyperscale networks. Our innovations ease system bandwidth bottlenecks while simultaneously improving on power, security, and reliability. Our connectivity solutions are optimized for optical and electrical Ethernet applications, including the emerging 100G (or Gigabits per second), 200G, 400G, 800G and the emerging 1.6T (or Terabits per second) port markets. Credo products are based on our proprietary Serializer/Deserializer (SerDes) and Digital Signal Processor (DSP) technologies. Our product families include Integrated Circuits (ICs) for the optical and line card markets, Active Electrical Cables (AECs) and SerDes Chiplets. Our intellectual property (IP) solutions consist primarily of SerDes IP licensing.

For more information, please visit https://www.credosemi.com.