Faraday Unveils FlashKit™-22RRAM: an eNVM-based SoC Development Platform for IoT
Hsinchu, Taiwan -- June 10, 2025 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its latest FlashKit™ development platform, FlashKit™-22RRAM, designed to accelerate high-performance IoT and MCU applications. Built on UMC’s 22ULP process, FlashKit™-22RRAM combines embedded Resistive RAM (RRAM、ReRAM) technology with a rich IP ecosystem and development-ready support, providing a cost-effective and power-efficient SoC solution for edge devices.
The FlashKit™-22RRAM platform integrates a full-featured RRAM subsystem with DWORD access, delivering comparable performance with SST eFlash. This solution minimizes extra-mask requirements, making it highly suitable for consumer-grade eNVM applications, such as AIoT, smart home, wearables, and portable devices. It is silicon proven and fully prepared to support customers' fast ramp-up to volume production on UMC’s 22ULP node.
FlashKit™-22RRAM supports embedded CPU options including ARM Cortex-M7 and VeeR EH1 RISC-V, and integrates a comprehensive set of integrated IPs such as USB 3.0 Type-C, GMAC, and PLL. A built-in RRAM controller with built-in self-test (BIST) ensures streamlined data access and high production reliability. In additional, embedded FPGA (eFPGA) block is included for enhanced design flexibility and enabling post-silicon logic change, ECO, or GPIO re-assignment.
“FlashKit™-22RRAM demonstrates Faraday’s continued commitment to delivering optimized platforms that reduce development effort and accelerate time-to-market,” said Flash Lin, COO of Faraday Technology. “Our customers now have a highly integrated and cost-efficient path to bring differentiated eNVM-based products to market quickly, with the flexibility to scale for future needs.”
About Faraday Technology Corporation
Faraday Technology Corporation (TWSE: 3035) is dedicated to the mission of benefiting humanity and upholding sustainable values in every IC it handles. The company offers a comprehensive range of ASIC solutions, including total 3DIC packaging, Neoverse CSS design, FPGA-Go-ASIC, and design implementation services. Furthermore, its extensive silicon IP portfolio encompasses a wide array of offerings, such as I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2, PCIe Gen4/3, and SerDes. For further details, visit www.faraday-tech.com
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