VeriSilicon Introduces FD-SOI Wireless IP Platform for Diverse IoT and Consumer Electronics Applications

Delivering high integration, low-power consumption, and silicon-proven solutions for various wireless standards

Shanghai, China, September 24, 2025--VeriSilicon (688521.SH) today introduced its wireless IP platform, designed to help customers rapidly develop energy-efficient, highly integrated chips for a wide range of IoT and consumer electronics applications. Built on the 22FDX^® (22nm FD-SOI) process technology of GlobalFoundries (GF), the platform supports wireless connectivity across short, medium, and long distances, and provides a complete set of IPs with competitive power, performance, and area (PPA) features.

The platform offers complete IP solutions for standards including Bluetooth Low Energy (BLE), Bluetooth Dual Mode (BTDM), NB-IoT, and Cat.1/Cat.4, encompassing RF, baseband, and software protocol stacks. RF IPs such as GNSS, 802.11ah, and 802.15.4g have already been adopted in multiple customer chip products and achieved mass production.

By fully utilizing the high-integration and low-power advantages of FD-SOI technology, VeriSilicon’s wireless IP platform has enabled customers to successfully deploy competitive MCUs and SoCs for various markets, including low-power BLE MCUs, home security cameras based on Wi-Fi 802.11ah, and multi-channel, high-precision Global Navigation Satellite System (GNSS) SoCs. Customers have shipped over 100 million chips based on these designs, achieving strong market recognition.

“Our 22FDX^® process technology delivers an ideal combination of low power, high performance, and cost efficiency for today’s connected devices,” said Ed Kaste, Senior Vice President of GF’s Ultra-Low Power CMOS Product Line. “We are excited to see VeriSilicon leverage our 22FDX^® process technology to provide customers with flexible, high-performance solutions, helping accelerate innovation across diverse markets.”

“As demand for low-power, multi-standard connectivity continues to grow in IoT and consumer markets, our wireless IP platform provides customers with a flexible, energy-efficient foundation to rapidly develop connected devices,” said Wiseway Wang, Executive Vice President and General Manager of Custom Silicon Platform Division at VeriSilicon. “For more than a decade, among the FD-SOI IPs we have developed on GF’s 22FDX^® process, over 60 have been licensed to 45 customers, with a total of more than 300 licenses. Crucially, we were among the very first to successfully apply FD-SOI Adaptive Body Biasing (ABB) technology in mass-produced chips. So far, we have customized FD-SOI chips for 43 customers, with 33 designs already in mass production, covering fields like satellites, automotive, and smart glasses. We will continue driving the future of FD-SOI innovation for emerging applications, such as Wi-Fi 6, satellite communications, millimeter-wave radar, and hearing aids.”

About GlobalFoundries

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com.

About VeriSilicon

VeriSilicon Microelectronics (Shanghai) Co., Ltd. (VeriSilicon, 688521.SH) is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP.

VeriSilicon possesses six categories of in-house processing IPs, namely Graphics Processing Unit (GPU) IP, Neural Network Processing Unit (NPU) IP, Video Processing Unit (VPU) IP, Digital Signal Processing (DSP) IP, Image Signal Processing (ISP) IP, and Display Processing IP, as well as more than 1,600 analog and mixed-signal IPs and RF IPs.

Leveraging its own IPs, VeriSilicon has developed a wealth of software and hardware custom chip design platforms targeting Artificial Intelligence (AI) applications, covering always-on ultralight spatial computing devices such as smartwatches and AR/VR glasses, high-efficiency edge computing devices such as AI PCs, AI phones, smart cars, and robots, as well as high-performance cloud computing devices like data centers and servers.

In response to the trend of System-on-Chip (SoC) evolving towards System-in-Package (SiP) driven by the demand for large computing power, VeriSilicon put forward the concepts of "IP as a Chiplet”, "Chiplet as a Platform", and "Platform as an Ecosystem”. The company keeps advancing the R&D and industrialization of its Chiplet technologies and projects from the perspective of interface IP, Chiplet architecture, advanced packaging technology, and others for AI-Generated Content (AIGC) and autonomous driving solutions.

Under its unique “Silicon Platform as a Service” (SiPaaS) business model, VeriSilicon serves a broad range of market segments, including consumer electronics, automotive electronics, computer and peripheral, industry, data processing, Internet of Things (IoT), among others. Its main customers include fabless, IDM, system vendors (OEM/ODM), large internet companies, and cloud service providers.

Founded in 2001 and headquartered in Shanghai, China, VeriSilicon has 8 design and R&D centers, along with 11 sales and customer service offices worldwide. VeriSilicon currently has more than 2,000 employees.