Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
By Anton Shilov, embedded.com (April 24, 2024)
Ceva’s new line up of IPs include Wi-Fi 6, Wi-Fi 7, Bluetooth 5.4, next-generation Bluetooth, narrowband IEEE 802.15.4 (for Thread, ZigBee, Matter), and UWB (FiRA 2.0 for consumer applications and CCC Digital Key 3.0 for automotive applications).
As contemporary devices strive for more connectivity, modern microcontrollers (MCUs) and system-on-chips (SoCs) for mobile, IoT, automotive, industrial, and consumer applications are gaining an increasing number of wireless connectivity technologies to support. As a result, developers of MCUs and SoCs need to either design appropriate IP themselves or license applicable IP from somewhere. Meanwhile, the fastest way to integrate support for multiple wireless standards is to license them from one shop.
To simplify integration of wireless interfaces for its customers, Ceva this month introduced its Ceva-Waves Links family of multi-protocol wireless platform IPs that are designed to work together and can be integrated rapidly into a chip. The lineup of silicon-proven IPs includes Wi-Fi 6, Wi-Fi 7, Bluetooth 5.4, next-generation Bluetooth, narrowband IEEE 802.15.4 (for Thread, ZigBee, Matter), and UWB (FiRA 2.0 for consumer applications and CCC Digital Key 3.0 for automotive applications). The IPs are optimized for co-existence on a single front end radio frequency module (FEM) to reduce physical footprint and can be pre-integrated with a low-power FEM if needed.
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- MIPI SWI3S Manager Core IP
- Ultra-low power high dynamic range image sensor
- Neural Video Processor IP
Related News
- Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
- Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
- ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
- Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report
Latest News
- Cyient Semiconductors Enters Strategic Channel Partnership with GlobalFoundries
- Aion Silicon Successfully Completes ISO 9001 and ISO/IEC 27001 Surveillance Audit, Strengthening Commitment to Quality and Security
- Baya Systems Awarded Globally Recognized ISO 9001:2015 Certification for Quality Management by TÜV Rheinland
- Si2 Announces Creation of the Si2 LLM Benchmarking Coalition
- Qualitas Semiconductor Signs Licensing Agreement with Chinese SoC Company for DSI-2 Controller and MIPI PHY IP