How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
Explore how CXL 3.1 and PCIe 6.2 are transforming AI efficiency for a futuristic tech landscape.
By Krishna Mallampati, VP of Sales and Marketing, XConn Technologies
EETimes | May 16, 2025
Today’s AI must overcome the boundaries of computational demands, massive data transfers, real-time processing and memory utilization. Traditional computing architectures, relying solely on PCle interconnects, struggle to keep pace with the rapid evolution of AI workloads, which is where CXL 3.1—the latest generation of the CXL standard—steps in, offering a fresh approach to memory and resource allocation.
To read the full article, click here
Related Semiconductor IP
Related News
- CXL Protocol Adds Capabilities over PCIe
- PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect
- Alphawave and PLDA Announce a Collaboration to Create Tightly-Integrated Controller and PHY IP Solutions for Interconnects Including PCIe 5.0, CXL and PCIe 6.0
- Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack