Is Imagination Technologies China’s backdoor to AI tech?
2025-01-13 08:43:00
Commentary / Analysis
Recent News
Indian Fabless startup Mindgrove Technologies secures $8million in Series A Funding round from Rocketship.vc and Speciale Invest
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Secure-IC's worldwide leading safe & secure automotive solutions achieve a new breakthrough: Securyzr™ S700 neo series reach ASIL-D grade
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JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards
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European and Japanese IDMs Strengthen Collaboration with Chinese Foundries to Capture “China for China” Opportunities
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Commentary / Analysis
Ceva Expands Embedded AI NPU Ecosystem with New Partnerships That Accelerate Time-to-Market for Smart Edge Devices
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Embedded Systems
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Commentary / Analysis
M31's 12nm GPIO IP Adopted by C*Core Technology, Powering Innovation in Advanced Process Automotive Chips
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Commentary / Analysis
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Embedded Systems
Ceva and Edge Impulse Unveil Enhanced Computer Vision Model for the Ceva-NeuPro™-Nano NPU IP Supported by NVIDIA’s TAO Toolkit
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Embedded Systems
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Deals
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Business
VeriSilicon’s Display Processing IP DC8200-FS has achieved ISO 26262 ASIL B certification
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IP
Indian Fabless startup Mindgrove Technologies secures $8million in Series A Funding round from Rocketship.vc and Speciale Invest
2025-01-10 14:36:00
Business
Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP
2025-01-10 08:41:00
Deals
Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles
2025-01-09 14:54:00
Deals
SpacemiT Secures Hundreds of Millions in A+ Financing to Accelerate RISC-V AI CPU Product Iteration
2025-01-09 14:41:00
Business
RISC-V Breakthrough: SpacemiT Develops Server CPU Chip V100 for Next-Generation AI Applications
2025-01-09 10:36:00
Chip
VESA to Update DisplayPort 2.1 with New Active Cable Specification for Up to 3X Longer DP80 Cables
2025-01-09 10:06:00
Standard
Secure-IC's worldwide leading safe & secure automotive solutions achieve a new breakthrough: Securyzr™ S700 neo series reach ASIL-D grade
2025-01-09 09:09:00
IP
JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards
2025-01-08 16:33:00
Standard
European and Japanese IDMs Strengthen Collaboration with Chinese Foundries to Capture “China for China” Opportunities
2025-01-08 15:01:00
Commentary / Analysis
Ceva Expands Embedded AI NPU Ecosystem with New Partnerships That Accelerate Time-to-Market for Smart Edge Devices
2025-01-08 14:57:00
Embedded Systems
Synopsys Collaborates with SiMa.ai on Automotive AI IP
2025-01-08 14:15:00
Commentary / Analysis
M31's 12nm GPIO IP Adopted by C*Core Technology, Powering Innovation in Advanced Process Automotive Chips
2025-01-08 10:56:00
Deals
Quantum Motion Announces Record Integration of Quantum Devices and Partnership with Semiconductor Manufacturer, GlobalFoundries
2025-01-08 10:47:00
Chip
Global Semiconductor Sales Increase 20.7% Year-to-Year in November
2025-01-08 09:08:00
Commentary / Analysis
BrainChip Unveils Edge AI Box Partner Ecosystem for Gestures, Cybersecurity, Image Recognition, and Computer Vision
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Embedded Systems
Ceva and Edge Impulse Unveil Enhanced Computer Vision Model for the Ceva-NeuPro™-Nano NPU IP Supported by NVIDIA’s TAO Toolkit
2025-01-07 20:52:00
Embedded Systems
Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration
2025-01-07 20:31:00
Deals
NXP Accelerates the Transformation to Software-Defined Vehicles (SDV) with Agreement to Acquire TTTech Auto
2025-01-07 19:34:00
Business
VeriSilicon’s Display Processing IP DC8200-FS has achieved ISO 26262 ASIL B certification
2025-01-07 19:24:00
IP