ChipAgents Raises Oversubscribed $21M Series A to Redefine AI for Chip Design 2025-10-21 14:53:00 Strategic Partnerships
Ceva Introduces Wi-Fi 7 1x1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems 2025-10-21 11:05:00 IP Cores & Design
Menta Brings its Pioneering eFPGA Technology to Embedded World North America 2025 2025-10-21 06:55:11 Events & Conferences
JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers 2025-10-20 14:11:29 Standards & Interconnects
Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access 2025-10-20 13:12:28 IP Cores & Design
NEXT Semiconductor Announces Availability of its' Full Waveform Capture Digital LiDAR Processor 2025-10-20 12:17:08 SoC Architecture & Assembly
Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology 2025-10-20 12:09:38 Foundries & Process Nodes
Alphawave Semi Achieves 2025 TSMC OIP Partner of the Year Award for High-Speed SerDes IP 2025-10-20 12:02:00 IP Cores & Design
SEALSQ Announces Development of QASIC, the Quantum-Resistant ASIC, By IC’Alps 2025-10-20 07:57:04 SoC Architecture & Assembly
GUC Expands Presence in Japan with New Office Opening in Yokohama 2025-10-20 06:56:00 Strategic Partnerships
Apple unleashes M5, the next big leap in AI performance for Apple silicon 2025-10-20 03:17:00 SoC Architecture & Assembly
Andes Showcases Expanding RISC-V Ecosystem and Next-Generation “Cuzco” High-Performance CPU at RISC-V Summit North America 2025 2025-10-17 17:01:04 Events & Conferences
Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities 2025-10-16 14:34:36 EDA & Design Tools
MIPI Alliance Releases New Groundbreaking Audio Interface Specification for High-Bandwidth, Low-Latency Consumer Electronics, Automotive and Industrial Applications 2025-10-16 13:10:00 Standards & Interconnects