SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
2025-06-26 07:09:00
Commentary / Analysis
Recent News
eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
2025-06-26 06:26:00
IP
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Embedded Systems
VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence
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HDMI Forum Releases Version 2.2 of the HDMI Specification
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Standard
Ubitium Accelerates Universal RISC-V Development with Siemens’ Veloce proFPGA CS
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EDA
Sofics Delivers Remarkable PPA & R Performance Near Physical Limits on TSMC 2nm Technology
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IP
Xiphera and Austin Electric Partner to Strengthen Hardware-Based Security in South Korea
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Business
Maven Silicon is now an Approved Training Partner of Altera’s Solution Acceleration Partner (ASAP) Program
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Other
Primemas Announces Customer Samples Milestone of World’s First CXL 3.0 SoC
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Chip
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Embedded Systems
Creonic's DVB-S2X/S2 IP Cores Now Support the New DVB-NIP Standard
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IP
Ceva Launches MotionEngine™ Hex: Bringing Precise, Touch-Free, Spatial Control to Smart TV, Gaming, and IoT Interfaces
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Embedded Systems
SEALSQ, ColibriTD, and Xdigit Announce Plan to Develop a Breakthrough Quantum Computing Based Solution Set to Revolutionize Semiconductor Wafer Yields for Sub-7nm Nodes
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Chip
Faraday Delivers Latest SerDes IP to Complete Interface Lineup on UMC’s 22nm Platform
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IP
Ausdia Solves Critical Design Flow Gap with OneSource Constraint Translation at DAC 2025
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EDA
Yocto Project Welcomes RISC-V International as New Platinum Member, Expands Global Ecosystem and Leads with Cyber Resilience Act Preparedness
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Embedded Systems
Continental to Create an Advanced Electronics & Semiconductor Solutions Organization
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Business
Arteris Addresses Silicon Design Reuse Challenge with New Magillem Packaging Product for IP Blocks and Chiplets
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EDA
Siemens turbocharges semiconductor and PCB design portfolio with generative and agentic AI
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EDA
eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
2025-06-26 06:26:00
IP
AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack
2025-06-26 05:43:00
Embedded Systems
VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence
2025-06-26 05:28:00
IP
HDMI Forum Releases Version 2.2 of the HDMI Specification
2025-06-25 13:26:00
Standard
Ubitium Accelerates Universal RISC-V Development with Siemens’ Veloce proFPGA CS
2025-06-25 11:34:00
EDA
Sofics Delivers Remarkable PPA & R Performance Near Physical Limits on TSMC 2nm Technology
2025-06-25 11:23:00
IP
Xiphera and Austin Electric Partner to Strengthen Hardware-Based Security in South Korea
2025-06-25 05:36:00
Business
Maven Silicon is now an Approved Training Partner of Altera’s Solution Acceleration Partner (ASAP) Program
2025-06-25 05:30:00
Other
Primemas Announces Customer Samples Milestone of World’s First CXL 3.0 SoC
2025-06-24 18:23:00
Chip
BrainChip and HaiLa Partner to Demonstrate Ultra-Low Power Edge AI Connectivity for IoT Sensor Applications
2025-06-24 13:22:00
Embedded Systems
Creonic's DVB-S2X/S2 IP Cores Now Support the New DVB-NIP Standard
2025-06-24 12:09:00
IP
Ceva Launches MotionEngine™ Hex: Bringing Precise, Touch-Free, Spatial Control to Smart TV, Gaming, and IoT Interfaces
2025-06-24 11:45:00
Embedded Systems
SEALSQ, ColibriTD, and Xdigit Announce Plan to Develop a Breakthrough Quantum Computing Based Solution Set to Revolutionize Semiconductor Wafer Yields for Sub-7nm Nodes
2025-06-24 11:39:00
Chip
Faraday Delivers Latest SerDes IP to Complete Interface Lineup on UMC’s 22nm Platform
2025-06-24 08:36:00
IP
Ausdia Solves Critical Design Flow Gap with OneSource Constraint Translation at DAC 2025
2025-06-23 17:01:00
EDA
Yocto Project Welcomes RISC-V International as New Platinum Member, Expands Global Ecosystem and Leads with Cyber Resilience Act Preparedness
2025-06-23 15:45:00
Embedded Systems
Continental to Create an Advanced Electronics & Semiconductor Solutions Organization
2025-06-23 15:26:00
Business
Arteris Addresses Silicon Design Reuse Challenge with New Magillem Packaging Product for IP Blocks and Chiplets
2025-06-23 13:02:00
EDA
Siemens turbocharges semiconductor and PCB design portfolio with generative and agentic AI
2025-06-23 12:55:00
EDA