EdgeQ Closes $75M Series-B Investment and Ramps to Customers' Demand for Its Award-Winning 5G+AI Base Station-on-a-Chip for 5G Networks
2023-04-20 16:46:00
Strategic Partnerships
Chiplet News Archive - Page 180 of 1945
EU agrees Chips Act terms
2023-04-20 16:46:00
Analysis & Insight
Esperanto Technologies Announces RISC-V Industry Milestone Of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
2023-04-20 13:07:00
SoC Architecture & Assembly
Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
2023-04-20 09:43:00
IP Cores & Design
The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE
2023-04-20 09:20:00
Misc
The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events
2023-04-19 15:27:00
Misc
Silicon Interfaces enhances Functional Safety ISO 26262-Compliant ASIL C Services Solution for Automotive
2023-04-19 08:19:00
Misc
Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
2023-04-18 16:01:00
Commercial Deals
Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions
2023-04-18 08:51:00
Commercial Deals
eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
2023-04-18 08:37:00
IP Cores & Design
Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps
2023-04-18 07:00:00
IP Cores & Design
Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
2023-04-17 16:35:00
EDA & Design Tools
TSMC could partner with Bosch for 28nm fab in Germany
2023-04-17 14:57:00
Analysis & Insight
Arm could be on the hook for $8.5bn of Softbank debt
2023-04-17 14:28:00
Analysis & Insight
Semidynamics launches world's first fully customisable RISC-V IP cores
2023-04-17 08:54:00
IP Cores & Design
DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
2023-04-17 07:13:00
IP Cores & Design
Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
2023-04-17 01:00:00
Misc
Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
2023-04-14 14:30:00
SoC Architecture & Assembly
MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services
2023-04-14 14:28:00
SoC Architecture & Assembly
Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show
2023-04-14 14:23:00
Misc