SiFive's New High-Performance Processors Offer a Significant Upgrade for Wearable and Consumer Products
2022-11-01 14:25:00
IP
Recent News
Quadric's New Chimera GPNPU Processor IP Blends NPU and DSP into New Category of Hybrid SoC Processor
2022-11-01 11:23:00
IP
Rambus and Samsung Electronics Extend Comprehensive Agreement
2022-10-31 14:08:00
Deals
Intel signs 7 out of top 10 fabless companies, sees 18A test chip
2022-10-31 10:00:00
Commentary / Analysis
Floadia Announces MTP IP without extra Mask Available on 55nm
2022-10-31 09:23:00
IP
Monthly Semiconductor Sales Decrease 0.5% Globally in September
2022-10-31 08:47:00
Commentary / Analysis
EnSilica growth continues with new Bristol ASIC design office
2022-10-31 08:40:00
Business
MIPI DSI and CSI Controllers IP Cores, for your High-Resolution Cameras, Display and Consumer Products, is available for immediate licensing
2022-10-31 02:40:00
Other
Xiphera provides versatility and compact footprint with two new SHA-3 IP cores
2022-10-28 15:22:00
IP
Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs
2022-10-28 08:33:00
IP
Report: TSMC stops work on Chinese AI chip amid sanctions confusion
2022-10-27 16:50:00
Commentary / Analysis
TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
2022-10-27 16:49:00
Foundries
Blueshift Memory Awarded Innovate UK Smart Grant to Develop AI Computer Vision Module
2022-10-27 16:48:00
Business
Siemens partners with TSMC for 3nm product certifications and other technology milestones
2022-10-27 16:48:00
EDA
Weebit Nano successfully qualifies its ReRAM module
2022-10-27 16:47:00
IP
Zynq® UltraScale+™ MPSoC FPGA: REFLEX CES adds a new FPGA version to its Zeus Zynq® UltraScale+™ MPSoC System-on-module
2022-10-27 16:47:00
Embedded Systems
SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million
2022-10-27 16:47:00
Business
Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings
2022-10-27 16:47:00
EDA
Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow
2022-10-27 16:47:00
EDA
Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies
2022-10-27 16:47:00
EDA
Quadric's New Chimera GPNPU Processor IP Blends NPU and DSP into New Category of Hybrid SoC Processor
2022-11-01 11:23:00
IP
Rambus and Samsung Electronics Extend Comprehensive Agreement
2022-10-31 14:08:00
Deals
Intel signs 7 out of top 10 fabless companies, sees 18A test chip
2022-10-31 10:00:00
Commentary / Analysis
Floadia Announces MTP IP without extra Mask Available on 55nm
2022-10-31 09:23:00
IP
Monthly Semiconductor Sales Decrease 0.5% Globally in September
2022-10-31 08:47:00
Commentary / Analysis
EnSilica growth continues with new Bristol ASIC design office
2022-10-31 08:40:00
Business
MIPI DSI and CSI Controllers IP Cores, for your High-Resolution Cameras, Display and Consumer Products, is available for immediate licensing
2022-10-31 02:40:00
Other
Xiphera provides versatility and compact footprint with two new SHA-3 IP cores
2022-10-28 15:22:00
IP
Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs
2022-10-28 08:33:00
IP
Report: TSMC stops work on Chinese AI chip amid sanctions confusion
2022-10-27 16:50:00
Commentary / Analysis
TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
2022-10-27 16:49:00
Foundries
Blueshift Memory Awarded Innovate UK Smart Grant to Develop AI Computer Vision Module
2022-10-27 16:48:00
Business
Siemens partners with TSMC for 3nm product certifications and other technology milestones
2022-10-27 16:48:00
EDA
Weebit Nano successfully qualifies its ReRAM module
2022-10-27 16:47:00
IP
Zynq® UltraScale+™ MPSoC FPGA: REFLEX CES adds a new FPGA version to its Zeus Zynq® UltraScale+™ MPSoC System-on-module
2022-10-27 16:47:00
Embedded Systems
SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million
2022-10-27 16:47:00
Business
Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings
2022-10-27 16:47:00
EDA
Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow
2022-10-27 16:47:00
EDA
Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies
2022-10-27 16:47:00
EDA