DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
April 17, 2023 - Global IP Core Sales - The DVB-S2X LDPC Decoder is a powerful FEC core decoder for Digital Video Broadcasting via Satellite. It implements extensions to the DVB-S2 design for better performance and efficiency as well as robust service availability.
Features Include:
- Irregular parity check matrix
- Layered Decoding
- Minimum sum algorithm
- Soft decision decoding
- BCH decoder works on GF (2m) where m=16 or 14 and corrects up to t errors, where t = 8, 10 or 12
- ETSI EN 302 307-1 V1.4.1 (2014-11) compliant
Key Features:
- Medium codeword length
- Extra code rates for finer gradation
- Adding 64, 128, 256 APSK
- Very low SNR down to -10dB
- Wideband support
Benefits:
- Improved performance
- Improved efficiency w.r.t. Shannon’s limit
- Finer gradation of code rate and SNR
- Very high data rate
- Maximum service availability at highest efficiency
- Enables cross layer optimization
Please contact us for more information or check out our product portfolio at www.global-ipc.com
About Global IP Core Sales:
Global IP Core Sales® was founded in 2021 and provides state-of-the-art IP Cores for the Semiconductor market. The majority of our products are silicon proven and can be seamlessly implemented into FPGA and ASIC technologies. Global IP Core Sales® will assist you with your IP Core and integration needs. Our mission is to grow your bottom line.
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core
- DVB-C2 LDPC/ BCH Decoder FEC IP Core From Global IP Core
- SmartDV Introduces Advanced H.264 and H.265 Video Encoder and Decoder IP
- Creonic to Supply New LDPC Decoder and Encoder IP Cores for CCSDS Standard
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications