TSMC could partner with Bosch for 28nm fab in Germany
By Peter Clarke, eeNews Europe (April 14, 2023)
A TSMC fab in Germany targeting a 28nm process is a less advanced development than previously expected – but also a more affordable one (see TSMC’s Dresden fab talks reach advanced stage, says report). While targeting 28nm could go some way to addressing security of automotive chip supply – an issue that got Germany’s attention during the pandemic crisis – it would do nothing for European strategic security and the region’s ability to manufacture at the leading-edge.
To read the full article, click here
Related Semiconductor IP
- 5G-NTN Modem IP for Satellite User Terminals
- AXI-S Protocol Layer for UCIe
- HBM4E Controller IP
- 14-bit 12.5MSPS SAR ADC - Tower 65nm
- 5G-Advanced Modem IP for Edge and IoT Applications
Related News
- Bosch opens wafer fab of the future in Dresden
- GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing
- ESMC Breaks Ground on Dresden Fab
- SkyWater to Acquire Infineon’s Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
Latest News
- OpenTitan Ships in Chromebooks: First Production Deployment
- Breker Verification Systems Adds RISC‑V Industry Expert Larry Lapides to its Advisory Board
- Weebit Nano’s ReRAM Selected for Korean National Compute-in-Memory Program
- Marvell Extends ZR/ZR+ Leadership with Industry-first 1.6T ZR/ZR+ Pluggable and 2nm Coherent DSPs for Secure AI Scale-across Interconnects
- BrainChip Announces Neuromorphyx as Strategic Customer and Go-to-Market Partner for AKD1500 Neuromorphic Processor