Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
2022-09-29 16:50:00
Commentary / Analysis
Recent News
Supply Chain Experts Weigh In on CHIPS Act
2022-09-29 16:50:00
Commentary / Analysis
AI "unicorn" Graphcore set to cut jobs
2022-09-29 16:50:00
Commentary / Analysis
SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency
2022-09-29 16:50:00
Embedded Systems
S2C Releases Neuro™ - Advanced Prototype Resource Management Software
2022-09-29 16:48:00
EDA
Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator
2022-09-29 16:45:00
Other
easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences
2022-09-29 13:49:00
IP
Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations
2022-09-28 15:26:00
Foundries
Automotive IC Marketshare Seen Rising to 10% by 2026
2022-09-28 08:10:00
Commentary / Analysis
Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
2022-09-27 15:09:00
EDA
PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready
2022-09-27 07:58:00
IP
Chips&Media Expands to New Markets such as Autonomous Vehicles
2022-09-27 07:49:00
Business
Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo
2022-09-27 06:12:00
Embedded Systems
Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware
2022-09-27 05:29:00
Embedded Systems
Arm announces new Board Members and new Chief Financial Officer
2022-09-27 05:21:00
People
SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors
2022-09-27 04:33:00
IP
U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification
2022-09-27 02:24:00
Foundries
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution
2022-09-26 15:14:00
EDA
GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
2022-09-26 13:28:00
FPGA
CXL Spec Grows, Absorbs Others to Collate Ecosystem
2022-09-26 11:10:00
Commentary / Analysis
Supply Chain Experts Weigh In on CHIPS Act
2022-09-29 16:50:00
Commentary / Analysis
AI "unicorn" Graphcore set to cut jobs
2022-09-29 16:50:00
Commentary / Analysis
SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency
2022-09-29 16:50:00
Embedded Systems
S2C Releases Neuro™ - Advanced Prototype Resource Management Software
2022-09-29 16:48:00
EDA
Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator
2022-09-29 16:45:00
Other
easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences
2022-09-29 13:49:00
IP
Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations
2022-09-28 15:26:00
Foundries
Automotive IC Marketshare Seen Rising to 10% by 2026
2022-09-28 08:10:00
Commentary / Analysis
Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
2022-09-27 15:09:00
EDA
PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready
2022-09-27 07:58:00
IP
Chips&Media Expands to New Markets such as Autonomous Vehicles
2022-09-27 07:49:00
Business
Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo
2022-09-27 06:12:00
Embedded Systems
Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware
2022-09-27 05:29:00
Embedded Systems
Arm announces new Board Members and new Chief Financial Officer
2022-09-27 05:21:00
People
SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors
2022-09-27 04:33:00
IP
U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification
2022-09-27 02:24:00
Foundries
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution
2022-09-26 15:14:00
EDA
GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
2022-09-26 13:28:00
FPGA
CXL Spec Grows, Absorbs Others to Collate Ecosystem
2022-09-26 11:10:00
Commentary / Analysis