Chiplet and D2D IP for TSMC
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- 3nm
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UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-A PHY for Advanced Package (x64) in TSMC N3E, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x32) in TSMC N3P, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY and Controller
- Supports MCM, BGA packages and Chiplet2Chiplet interconnects on PCB
- Available process nodes: 28, 22, 16, 12, 7, 6nm
- X16 and X32 PHY with bump maps defined in UCIe 2.0 specifications
- Industry leading power consumption
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IPTD2D-A PHY and Controller
- Our mass production-proven IPTD2D-A D2D Interconnect IP Solutions offer industry-leading power efficiency, performance, and low latency, tailored for the next generation of high-performance computing, AI, and data center applications.
- With asynchronous “side-band” signals, the IPTD2D PHY can work at any frequency ranging from 2Gbps to 16Gbps, achieving the best balance between total bandwidth and power consumption.
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Chiplet Interconnect - Die-to-die interconnect IP solutions for advanced and standard packaging applications
- High data rate of 2–24 Gb/s
- Very low power of < 0.375 pJ/bit @ 2–16 Gb/s 0.5-V VDDQ
- Very low latency of < 2 ns PHY-to-PHY
- Support for 2:1, 4:1, 8:1, 12:1 and 16:1 serialization and deserialization ratios
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UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
- Data rates up to 16Gbps per pin
- Self-contained hard macro
- Self-calibrating and training
- Side band channel for initialization and parameter exchange
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UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
- Data rates up to 16Gbps per pin
- Self-contained hard macro
- Self-calibrating and training
- Side band channel for initialization and parameter exchange