UCIe IP for TSMC
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- 3nm
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UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-A PHY for Advanced Package (x64) in TSMC N3E, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x32) in TSMC N3P, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S 64GT/s PHY IP
- The UCIe-S 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects between dies in standard packaging environments.
- Leveraging the UCIe (Universal Chiplet Interconnect Express) 3.0 standard, this IP supports a blistering data rate of up to 64Gbps per lane, enabling next-generation AI, HPC, and data center SoC applications.
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Chiplet Interconnect - Die-to-die interconnect IP solutions for advanced and standard packaging applications
- High data rate of 2–24 Gb/s
- Very low power of < 0.375 pJ/bit @ 2–16 Gb/s 0.5-V VDDQ
- Very low latency of < 2 ns PHY-to-PHY
- Support for 2:1, 4:1, 8:1, 12:1 and 16:1 serialization and deserialization ratios
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UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
- Data rates up to 16Gbps per pin
- Self-contained hard macro
- Self-calibrating and training
- Side band channel for initialization and parameter exchange
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UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
- Data rates up to 16Gbps per pin
- Self-contained hard macro
- Self-calibrating and training
- Side band channel for initialization and parameter exchange