Bunch of Wires IP for TSMC
Welcome to the ultimate
Bunch of Wires IP
for
TSMC
hub! Explore our vast directory of
Bunch of Wires IP
for
TSMC
All offers in
Bunch of Wires IP
for
TSMC
Filter
Compare
1
Bunch of Wires IP
for TSMC
from 1 vendors
(1
-
1)
Filter:
- 3nm
-
Chiplet Interconnect - Die-to-die interconnect IP solutions for advanced and standard packaging applications
- High data rate of 2–24 Gb/s
- Very low power of < 0.375 pJ/bit @ 2–16 Gb/s 0.5-V VDDQ
- Very low latency of < 2 ns PHY-to-PHY
- Support for 2:1, 4:1, 8:1, 12:1 and 16:1 serialization and deserialization ratios