Why do we need 450mm wafers?
May 2, 2013
This is a question often asked by journalists and others not directly involved in 450mm technology, and indeed was one of the questions that formed the basis of the SMART 2010/062 report Future Horizons produced for the European Commission.
It is also a question every new 450mm project has to answer in its funding request to the European Commission, and whilst working on the Bridge450 submission we realised the arguments have become rather unclear over time. The following gives some insight and clarity into the question.
To read the full article, click here
Related Semiconductor IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
- SM4 Cipher Engine
Related Blogs
- Do we need a new FPGA structure for prototyping?
- IP integration: what standards do we need?
- Do We Need Fab?
- Why the HMAC did we do this?
Latest Blogs
- Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum
- Accelerating Development Cycles and Scalable, High-Performance On-Device AI with New Arm Lumex CSS Platform
- Desktop-Quality Ray-Traced Gaming and Intelligent AI Performance on Mobile with New Arm Mali G1-Ultra GPU
- Powering Scale Up and Scale Out with 224G SerDes for UALink and Ultra Ethernet
- Arm and Synopsys: Delivering an Integrated, Nine-Stage “Silicon-to-System” Chip Design Flow