Understanding Anti-Tamper Technology: Part 2
In part one of this three-part blog series, we discussed the low-cost attacks that target security chips such as protocol and software attacks, brute force glitch attacks, as well environmental attacks. In this blog post, we explore attacks executed by more sophisticated adversaries. These include side-channel attacks, clocking attacks, fault injection, and infrared emission analysis.
Sophisticated attackers – who might be working at the university level – can research the security model of your chip. Specifically, they can analyze your chip security using techniques such as side-channel attacks, clocking attacks, fault injections, and infrared emission analysis. Let’s take a closer look at these techniques below.
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Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related Blogs
- Understanding Anti-Tamper Technology: Part 1
- Understanding Anti-Tamper Technology: Part 3
- Key Takeaways from the TSMC Technology Symposium Part 2
- ST-Ericsson (Part 2): Diverse Offering