Understanding Anti-Tamper Technology: Part 2
In part one of this three-part blog series, we discussed the low-cost attacks that target security chips such as protocol and software attacks, brute force glitch attacks, as well environmental attacks. In this blog post, we explore attacks executed by more sophisticated adversaries. These include side-channel attacks, clocking attacks, fault injection, and infrared emission analysis.
Sophisticated attackers – who might be working at the university level – can research the security model of your chip. Specifically, they can analyze your chip security using techniques such as side-channel attacks, clocking attacks, fault injections, and infrared emission analysis. Let’s take a closer look at these techniques below.
To read the full article, click here
Related Semiconductor IP
- Securyzr™ neo Core Platform
- 112G Multi-SerDes
- SHA3 Cryptographic Hash Cores
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
Related Blogs
- Understanding Anti-Tamper Technology: Part 1
- Understanding Anti-Tamper Technology: Part 3
- Key Takeaways from the TSMC Technology Symposium Part 2
- ST-Ericsson (Part 2): Diverse Offering
Latest Blogs
- Why Anti-tamper Sensors Matter: Agile Analog and Rambus Deliver Comprehensive Security Solution
- Automotive Ethernet with Comcores – Safety, Quality and ASIL certification of IP
- A Comparison on Different AMBA 5 CHI Verification IPs
- Cadence Recognized as TSMC OIP Partner of the Year at 2025 OIP Ecosystem Forum
- Accelerating Development Cycles and Scalable, High-Performance On-Device AI with New Arm Lumex CSS Platform