Top 10 Highlights of the TSMC 2018 Technology Symposium
May 7, 2018
Here are the Top 10 highlights from the recent TSMC 2018 Technology Symposium, held in Santa Clara CA. A couple of years ago, TSMC acknowledged the unique requirements of 4 different market segments, which has since guided their process development strategy -- Mobile, High-Performance Computing (HPC), Automotive, and IoT. Many of the highlights described below are in the context of a specific platform.
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Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
Related Blogs
- TSMC Technology Symposium 2018
- Key Takeaways from the TSMC Technology Symposium Part 1
- TSMC Technology Symposium: Process Status
- Key Takeaways from the TSMC Technology Symposium Part 2
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