What It Will Take to Build a Resilient Automotive Compute Ecosystem
The modern vehicle is no longer just a mechanical machine, but a dynamic computing platform defined by software and evolving toward an era of AI-defined intelligence that learns, adapts, and improves over time. For automakers and suppliers, this shift is reshaping everything from product roadmaps to procurement strategy.
Since the 2021 global chip shortage, which exposed vulnerabilities across the supply chain, one question has taken center stage: Should companies bring more control in-house, or partner more deeply across the value chain? At first glance, vertical integration promises tighter control, and some OEMs are already exploring custom chips and proprietary software stacks. However, this can come at a high cost – in capital, time, and talent.
The pace of innovation and complexity of future AI-defined vehicles suggest another path: strategic collaboration, or what some now call “coopetition.”
To read the full article, click here
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
Related Blogs
- SiFive Upgrades Automotive Security for the RISC-V Ecosystem with New ISO/SAE 21434 Certification
- Jumpstarting the Automotive Chiplet Ecosystem
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- How an Nvidia/ARM deal could create the dominant ecosystem for the next computer era
Latest Blogs
- Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards
- Pushing the Boundaries of Memory: What’s New with Weebit and AI
- Root of Trust: A Security Essential for Cyber Defense
- Evolution of AMBA AXI Protocol: An Introduction to the Issue L Update
- An Introduction to AMBA CHI Chip-to-Chip (C2C) Protocol