What It Will Take to Build a Resilient Automotive Compute Ecosystem
The modern vehicle is no longer just a mechanical machine, but a dynamic computing platform defined by software and evolving toward an era of AI-defined intelligence that learns, adapts, and improves over time. For automakers and suppliers, this shift is reshaping everything from product roadmaps to procurement strategy.
Since the 2021 global chip shortage, which exposed vulnerabilities across the supply chain, one question has taken center stage: Should companies bring more control in-house, or partner more deeply across the value chain? At first glance, vertical integration promises tighter control, and some OEMs are already exploring custom chips and proprietary software stacks. However, this can come at a high cost – in capital, time, and talent.
The pace of innovation and complexity of future AI-defined vehicles suggest another path: strategic collaboration, or what some now call “coopetition.”
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related Blogs
- SiFive Upgrades Automotive Security for the RISC-V Ecosystem with New ISO/SAE 21434 Certification
- Jumpstarting the Automotive Chiplet Ecosystem
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- How an Nvidia/ARM deal could create the dominant ecosystem for the next computer era
Latest Blogs
- ReRAM in Automotive SoCs: When Every Nanosecond Counts
- AndeSentry – Andes’ Security Platform
- Formally verifying AVX2 rejection sampling for ML-KEM
- Integrating PQC into StrongSwan: ML-KEM integration for IPsec/IKEv2
- Breaking the Bandwidth Barrier: Enabling Celestial AI’s Photonic Fabric™ with Custom ESD IP on TSMC’s 5nm Platform