Jumpstarting the Automotive Chiplet Ecosystem
The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren't just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, application-specific integrated circuits (ASICs).
In a major push to advance the automotive chiplet ecosystem, Cadence Design Systems and Arm have teamed up to slash development time, accelerate product innovation, and foster a new era of collaboration. This groundbreaking collaboration doesn't just cater to the present needs of the automotive sector but also sets the tone for the future of mobility solutions.
Related Semiconductor IP
- UCIe-S PHY for Standard Package (x16) in TSMC N5A, N/S, for Automotive, ASIL B Random, AEC-Q100 Grade 2
- LPDDR4X multiPHY - TSMC 16FFC18 for Automotive, ASIL B Random, AEC-Q100 Grade 2
- LPDDR4 multiPHY V2 - SS 8LPP for Automotive AEC-Q100 Grade 1
- LPDDR4 multiPHY V2 - GF 22FDX18 for Automotive, ASIL B Random, AEC-Q100 Grade 1
- Performance Enhanced version of uMCTL2 supporting DDR4, DDR3, DDR2, LPDDR4, LPDDR3 and LPDDR2 for Automotive
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- UCIe Heralds a Robust Chiplet Ecosystem for a New Era of SoC Innovation
- Arm Ecosystem Collaborates on Standards to Enable a Thriving Chiplet Market
- SiFive Upgrades Automotive Security for the RISC-V Ecosystem with New ISO/SAE 21434 Certification
- Cadence Commits to Join imec Automotive Chiplet Programme
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