Jumpstarting the Automotive Chiplet Ecosystem
The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren't just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, application-specific integrated circuits (ASICs).
In a major push to advance the automotive chiplet ecosystem, Cadence Design Systems and Arm have teamed up to slash development time, accelerate product innovation, and foster a new era of collaboration. This groundbreaking collaboration doesn't just cater to the present needs of the automotive sector but also sets the tone for the future of mobility solutions.
To read the full article, click here
Related Semiconductor IP
- Embedded Hardware Security Module (Root of Trust) - Automotive Grade ISO 26262 ASIL-B
- Highest performance automotive GPU IP, with revolutionary functional safety technology
- Automotive Grade PVT Sensor on TSMC CLN22ULL
- Automotive Grade PVT Sensor on TSMC CLN16FFC
- Automotive Grade Power On Reset on TSMC CLN22ULL
Related Blogs
- UCIe Heralds a Robust Chiplet Ecosystem for a New Era of SoC Innovation
- Arm Ecosystem Collaborates on Standards to Enable a Thriving Chiplet Market
- SiFive Upgrades Automotive Security for the RISC-V Ecosystem with New ISO/SAE 21434 Certification
- Cadence Commits to Join imec Automotive Chiplet Programme