Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets
The shift from monolithic to multi-die design is inevitable — but that's not to say it's straightforward. Traditional monolithic design has clear limitations. Diminishing yield and high cost-per-die become issues when a design nears reticle limits. At this point, multi-die integration can break the system into a series of smaller dies and to overcome scale and cost issues of scale.
Hyperscalers and other high-performance computing companies have noted that chiplets enable collaborative design within a multi-die context that delivers cost advantages and "mix-and-match integration” across heterogeneous IP blocks. Unfortunately, the chiplet ecosystem has yet to be completely standardized. Chiplet-based design incurs challenges around packaging, power delivery, verification, timing, floor planning, security, testability, and thermal management.
Together with Alchip Technologies, a high-performance computing and AI ASIC company, Synopsys addresses these issues to deliver the ROI and physical benefits of a multi-die design.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
Related Blogs
- Samsung Foundry and Synopsys Accelerate Multi-Die System Design
- How Collaboration Will Accelerate Adoption of Multi-Die Systems
- Ensuring the Health and Reliability of Multi-Die Systems
- How Photonics Can Light the Way for Higher Performing Multi-Die Systems
Latest Blogs
- Cadence Powers AI Infra Summit '25: Memory, Interconnect, and Interface Focus
- Integrating TDD Into the Product Development Lifecycle
- The Hidden Threat in Analog IC Migration: Why Electromigration rules can make or break your next tapeout
- MIPI CCI over I3C: Faster Camera Control for SoC Architects
- aTENNuate: Real-Time Audio Denoising