Globalfoundries 22FDX Technology Shows Advantages in PPA over 28nm Node
November 23, 2015
I really enjoy ARM Techcon when it rolls around every year because it has such a wide range of topics and exhibits. You can find maker gadgets, IoT information, small boards for industrial control, software development kits, semiconductor IP vendors as well as the big EDA players and foundries. This year after perusing the exhibit floor I attended a talk sponsored by Cadence on the topic of using Globalfoundries 22NM FD-SOI process to implement a quad core ARM Cortex-A17.
Joerg Winkler and Tamer Ragheb with Globalfoundries discussed the rational for choosing their 22FDX technology for this project. After which, they went into to the specifics of using Cadence Innovus for the actual physical design process.
Related Semiconductor IP
- 512x8 Bits OTP (One-Time Programmable) IP, GLOBALFOUNDRIES 0.13um BCD 1.5V/5V Process
- 5V ESD Clamp in GlobalFoundries 180nm LPe
- DDR4 Multi-modal PHY - GLOBALFOUNDRIES 12nm
- DDR3 PHY - GLOBALFOUNDRIES 12nm
- DDR4 PHY - GLOBALFOUNDRIES 12nm
Related Blogs
- How LETI IP will speed-up GlobalFoundries 22FDX ASIC Development
- Automotive Rising! GLOBALFOUNDRIES' 22FDX (FD-SOI) Accelerates
- 22FDX Shows IoT Traction at MWC 2018
- Milliwatts per Gigahash: Crypto Miner ASICs Look to 22FDX
Latest Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Migrating the CPU IP Development from MIPS to RISC-V Instruction Set Architecture
- Quintauris: Accelerating RISC-V Innovation for next-gen Hardware
- Say Goodbye to Limits and Hello to Freedom of Scalability in the MIPS P8700
- Why is Hard IP a Better Solution for Embedded FPGA (eFPGA) Technology?