Foundries Have Stepped Up To The Challenge, says ARM VP
April 24, 2014
The foundry industry has motored to catch up with Intel on process technology.
“In the last couple of years, with Intel being forthright about getting into in the mobile space and quoting process node advantage as a way to leadership in the marketplace, that has woken up the foundries to the challenge,” says ARM vp Noel Hurley.
Now, TSMC, Samsung, and GloFo are all saying they’ll be out with mobile SOCs on 14/16nm this year. That is the same timing as Intel which says it will be producing on 14nm this year.
“The foundry group have stepped up to the challenge and, on the IP side, we have stepped up,” says Hurley.
To read the full article, click here
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
Related Blogs
- Can All The Riches Of Arabia Loosen TSMC's Grip On The Foundry Industry?
- Should Intel Offer Foundry Services?
- Can Intel be a Leading Semiconductor Foundry?
- Will Intel leave Mobile, Foundry, and FPGA Business?
Latest Blogs
- Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards
- Pushing the Boundaries of Memory: What’s New with Weebit and AI
- Root of Trust: A Security Essential for Cyber Defense
- Evolution of AMBA AXI Protocol: An Introduction to the Issue L Update
- An Introduction to AMBA CHI Chip-to-Chip (C2C) Protocol