AI Hardware Summit Event Recap: Interview with Steven Woo
The fifth annual AI Hardware Summit was back this month, and for the first time in a couple of years, it took place fully in-person in Santa Clara, California. The world’s leading experts in AI hardware came together over the course of three days to discuss some of the big challenges facing the industry, and amongst them was Rambus Fellow, Steven Woo.
We caught up with Steven to find out all about the event and learn more about the panel discussion he led on one of the primary challenges for AI hardware and systems, the AI memory bottleneck.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related Blogs
- Focus on Memory at AI Hardware Summit
- From vision to reality in RISC-V: Interview with Karel Masarik
- Alphawave Semi Elevates AI with Cutting-Edge HBM4 Technology
- Reducing Manual Effort and Achieving Better Chip Verification Coverage with AI and Formal Techniques