A Confident ASIC Design Path through Co-Creation
The first blog in this series talked about the competitive benefits to differentiating OEM products in hardware as well as software, followed by a high-level view of our co-creation programs. In this blog I would like to talk a bit more about the way we at CEVA and Intrinsix approach collaboration with OEM and semiconductor, for a confident path to turnkey ASIC design or to wireless subsystem design. To illustrate, imagine the kind of SoC you might want to build for a wireless smart speaker or smart home entertainment system. Core to this system is an audio pipeline supporting voice processing for control commands and wireless connectivity through Wi-Fi and Bluetooth connectivity, where the BT connection could be for remote control or audio streaming. We also include on-chip RF for Bluetooth and WiFi. An overall block diagram is shown below.
To read the full article, click here
Related Semiconductor IP
- JESD204E Controller IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
Related Blogs
- Why thinking about software and security is so important right at the start of an ASIC design
- What are AI Chips? A Comprehensive Guide to AI Chip Design
- Cadence Generative AI Solution: A Comprehensive Suite for Chip-to-System Design
- Reducing design cycle time for semiconductor startups: The path from MVP to commercial viability
Latest Blogs
- A Low-Leakage Digital Foundation for SkyWater 90nm SoCs: Introducing Certus’ Standard Cell Library
- FPGAs vs. eFPGAs: Understanding the Key Differences
- UCIe D2D Adapter Explained: Architecture, Flit Mapping, Reliability, and Protocol Multiplexing
- RT-Europa: The Foundation for RISC-V Automotive Real-Time Computing
- Arm Flexible Access broadens its scope to help more companies build silicon faster