A Confident ASIC Design Path through Co-Creation
The first blog in this series talked about the competitive benefits to differentiating OEM products in hardware as well as software, followed by a high-level view of our co-creation programs. In this blog I would like to talk a bit more about the way we at CEVA and Intrinsix approach collaboration with OEM and semiconductor, for a confident path to turnkey ASIC design or to wireless subsystem design. To illustrate, imagine the kind of SoC you might want to build for a wireless smart speaker or smart home entertainment system. Core to this system is an audio pipeline supporting voice processing for control commands and wireless connectivity through Wi-Fi and Bluetooth connectivity, where the BT connection could be for remote control or audio streaming. We also include on-chip RF for Bluetooth and WiFi. An overall block diagram is shown below.
To read the full article, click here
Related Semiconductor IP
- 8MHz / 40MHz Pierce Oscillator - X-FAB XT018-0.18µm
- UCIe RX Interface
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
Related Blogs
- Why thinking about software and security is so important right at the start of an ASIC design
- What are AI Chips? A Comprehensive Guide to AI Chip Design
- Cadence Generative AI Solution: A Comprehensive Suite for Chip-to-System Design
- Reducing design cycle time for semiconductor startups: The path from MVP to commercial viability
Latest Blogs
- PQMicroLib-Core now supports PSA Certified Crypto API
- Imagination Demonstrates DirectX Gaming on D-Series GPUs
- Embedded Security explained: Post-Quantum Cryptography (PQC) for embedded Systems
- Accreditation Without Compromise: Making eFPGA Assurable for Decades
- Synopsys Delivers First Complete UFS 5.0 and M‑PHY v6.0 IP Solution for Next‑Gen Storage