Cadence Generative AI Solution: A Comprehensive Suite for Chip-to-System Design
I am thrilled to reintroduce you to a groundbreaking development in the realm of electronic system design—the Cadence Joint Enterprise Data and Analytics (JedAI) Generative AI Solution. First unveiled with Cadence Cerebrus in 2021, and in its full scope at CadenceLIVE 2023, this innovative solution comprises five powerful applications that span from semiconductor chip design to system optimization. Learn more about AI from chips to systems.
Let's delve into each of these applications and explore how they can revolutionize the design process, providing optimized performance, opportunities for differentiation, and substantial workflow productivity gains.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- Neuromorphic Processor IP
- Lossless & Lossy Frame Compression IP
Related Blogs
- The Evolution of Generative AI up to the Model-Driven Era
- GDDR7: The Ideal Memory Solution in AI Inference
- Renesas Collaborates on Large Language Model Generative AI Chip Design
- Leveraging AI to Optimize the Debug Productivity and Verification Throughput
Latest Blogs
- MIPS P8700 RISC-V Processor for Advanced Functional Safety Systems
- Boost SoC Flexibility: 4 Design Tips for Memory Subsystems with Combo DDR3/4 Interfaces
- High Bandwidth Memory Evolution from First Generation HBM to the Latest HBM4
- Keeping Pace with CXL Specification Revisions
- Silicon-proven LVTS for 2nm: a new era of accuracy and integration in thermal monitoring