Can 450nm Decommoditize the Semiconductor Industry?
Is the transition from 300mm to 450mm wafers just driven by 20-30% cost reduction? Or is there more to it than meets the eye? Let's take a look...
Like many semiconductor enthusiasts, my day begins with a look at EETimes. Imagine my surprise a few days back when I saw a story about Intel, TSMC, IBM, Samsung and Globalfoundries joining forces to do 450mm chip R&D in New York (Figure 1)! Now, as we know, the 300mm to 450mm wafer transition can produce around 20-25% cost savings if all goes well. That raises the question: Are rivals such as Intel, TSMC and Samsung working together just to get 20-25% cost savings? Or is there more at stake?
Let's analyze the situation...
To read the full article, click here
Related Semiconductor IP
- eDP 2.0 Verification IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
- LLM AI IP Core
- Post-Quantum Digital Signature IP Core
- Compact Embedded RISC-V Processor
Related Blogs
- Dr. Wally Rhines on global semiconductor industry outlook 2013
- Global semiconductor industry to grow 7.9 percent in 2013
- Silicon Valley Must Reinvigorate the Semiconductor Industry
- A Three-Tier Business Model for benefitting the Global Semiconductor Industry
Latest Blogs
- From GPUs to Memory Pools: Why AI Needs Compute Express Link (CXL)
- Verification of UALink (UAL) and Ultra Ethernet (UEC) Protocols for Scalable HPC/AI Networks using Synopsys VIP
- Enhancing PCIe6.0 Performance: Flit Sequence Numbers and Selective NAK Explained
- Smarter ASICs and SoCs: Unlocking Real-World Connectivity with eFPGA and Data Converters
- RISC-V Takes First Step Toward International Standardization as ISO/IEC JTC1 Grants PAS Submitter Status