Can 450nm Decommoditize the Semiconductor Industry?
October 3, 2011
Is the transition from 300mm to 450mm wafers just driven by 20-30% cost reduction? Or is there more to it than meets the eye? Let's take a look...
Like many semiconductor enthusiasts, my day begins with a look at EETimes. Imagine my surprise a few days back when I saw a story about Intel, TSMC, IBM, Samsung and Globalfoundries joining forces to do 450mm chip R&D in New York (Figure 1)! Now, as we know, the 300mm to 450mm wafer transition can produce around 20-25% cost savings if all goes well. That raises the question: Are rivals such as Intel, TSMC and Samsung working together just to get 20-25% cost savings? Or is there more at stake?
Let's analyze the situation...
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Complex Digital Up Converter
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
- MIPI SWI3S Manager Core IP
Related Blogs
- A Brief History of the Fabless Semiconductor Industry
- Dr. Wally Rhines on global semiconductor industry outlook 2013
- Global semiconductor industry to grow 7.9 percent in 2013
- Silicon Valley Must Reinvigorate the Semiconductor Industry
Latest Blogs
- CNNs and Transformers: Decoding the Titans of AI
- How is RISC-V’s open and customizable design changing embedded systems?
- Imagination GPUs now support Vulkan 1.4 and Android 16
- From "What-If" to "What-Is": Cadence IP Validation for Silicon Platform Success
- Accelerating RTL Design with Agentic AI: A Multi-Agent LLM-Driven Approach