Can 450nm Decommoditize the Semiconductor Industry?
October 3, 2011
Is the transition from 300mm to 450mm wafers just driven by 20-30% cost reduction? Or is there more to it than meets the eye? Let's take a look...
Like many semiconductor enthusiasts, my day begins with a look at EETimes. Imagine my surprise a few days back when I saw a story about Intel, TSMC, IBM, Samsung and Globalfoundries joining forces to do 450mm chip R&D in New York (Figure 1)! Now, as we know, the 300mm to 450mm wafer transition can produce around 20-25% cost savings if all goes well. That raises the question: Are rivals such as Intel, TSMC and Samsung working together just to get 20-25% cost savings? Or is there more at stake?
Let's analyze the situation...
To read the full article, click here
Related Semiconductor IP
- Network-on-Chip (NoC)
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- DVB-S2 Demodulator
- UCIe PHY (Die-to-Die) IP
- UCIe-S 64GT/s PHY IP
Related Blogs
- Dr. Wally Rhines on global semiconductor industry outlook 2013
- Global semiconductor industry to grow 7.9 percent in 2013
- Silicon Valley Must Reinvigorate the Semiconductor Industry
- A Three-Tier Business Model for benefitting the Global Semiconductor Industry
Latest Blogs
- Enabling End-to-End EDA Flow on Arm-Based Compute for Infrastructure Flexibility
- Real PPA improvements from analog IC migration
- Design specification: The cornerstone of an ASIC collaboration
- The importance of ADCs in low-power electrocardiography ASICs
- VESA Adaptive-Sync V2 Operation in DisplayPort VIP