450mm - Who? When? Why?
The drive towards 450mm is not as unified as it was because the motivations of the three main protagonists have altered.
Back in the summer of 2012, Intel, Samsung and TSMC invested in ASML to fund the development of 450mm
Samsung bought a 3% stake in ASML for €503 million with a commitment to put up €276m for ASML’s R&D programmes.
Intel paid $3 billion for a 15% stake in ASML and said it would put another $1 billion into the R&D projects.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- When countries rush to secure the first 450mm fab
- Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?
- Why 450mm Will Be Pushed-Back Even Further
- Why Focus Solely on CPU & GPU When Reducing SoC Power?
Latest Blogs
- Rethinking Edge AI Interconnects: Why Multi-Protocol Is the New Standard
- Tidying Up: FIPS-Compliant Secure Zeroization for OTP
- Accelerating Your Development: Simplify SoC I/O with a Single Multi-Protocol SerDes IP
- Why What Where DIFI and the new version 1.3
- Accelerating PCIe Gen6 L0p Verification for AI & HPC Designs using Synopsys VIP