When countries rush to secure the first 450mm fab
Will there be a tipping point at which chip companies and governments rush to build the first 450mm fab?
For the past few years, the debate on 450mm has been on whether the chip industry wnts it, whether the equipment industry wants it, whether it will reduce chip cost and who will fund it.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related Blogs
- Support For European 450mm Fab Strengthening
- Advanced Fab Capacity Utilisation Tops 90%
- Fab allocation back on the agenda
- Is 450mm A Dead Duck?
Latest Blogs
- lowRISC Tackles Post-Quantum Cryptography Challenges through Research Collaborations
- How to Solve the Size, Weight, Power and Cooling Challenge in Radar & Radio Frequency Modulation Classification
- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction
- The Integrated Design Challenge: Developing Chip, Software, and System in Unison
- Introducing Mi-V RV32 v4.0 Soft Processor: Enhanced RISC-V Power