Interface IP Cores for TSMC
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Interface IP Cores
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- 16nm
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USB 2.0 PHY
- Designed to the USB 2.0 specification, and operates at High Speed (480Mbps), Full Speed (12Mbps), and Low Speed (1.5Mbps)
- Complies with the UTMI v1.05 specification
- Multiple reference clock supported from 9.6MHz up to 52MHz
- 8-bit 60MHz and 16-bit 30MHz parallel interfaces
- Battery Charging Specification v1.2
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10Gbps Multi-Link and Multi-Protocol PCIe 3.1 PHY IP for TSMC
- Supports USB 3.1, PCIe 3.0/2.0/1.0, DP-TX v1.4/ eDP-TX v1.4b, SATA 3, 10G-KR and SGMII
- Supports PCIe L1 sub-states
- Supports SRIS and internal SSC generation
- Supports internal and external clock sources with clock active detection
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PDM-to-PCM Conversion with AMBA Interface
- SNR 100dB; THD -100dB
- PDM (pulse-density modulated) Input
- PCM (pulse-code modulated) output
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MIPI D-PHY
- Multiple Configurations Possible. TX-only (with integrated PLL), RX-only, and combined TX and RX configurations
- Complete Function for HS TX/RX, LP TX/RX, and LPCD with automatic termination control for high-speed and low-power modes
- Integrated BIST Capable of producing and checking PRBS, CRPAT, and CJTPAT
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USB 2.0 femtoPHY - TSMC 16FFC18 x1, OTG, North/South (vertical) poly orientation for Automotive AEC-Q100 Grade 2
- Ported to over 50 different processes and configurations ranging from 65-nm to 14/16-nm FinFET
- Supports the USB 2.0 protocol and data rate (480 Mbps)
- Supports the USB Type-C specification
- USB femtoPHY, USB nanoPHY and USB picoPHY offer a tunability feature that allows quick, post-silicon adjustments that occur due to process variations, or unexpected chip and board parasitic, without modifying the existing design
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USB 2.0 femtoPHY - TSMC 16FFC18 x1, OTG, North/South (vertical) poly orientation
- Ported to over 50 different processes and configurations ranging from 65-nm to 14/16-nm FinFET
- Supports the USB 2.0 protocol and data rate (480 Mbps)
- Supports the USB Type-C specification
- USB femtoPHY, USB nanoPHY and USB picoPHY offer a tunability feature that allows quick, post-silicon adjustments that occur due to process variations, or unexpected chip and board parasitic, without modifying the existing design
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USB 2.0 femtoPHY - TSMC 16FF+LL18 x1, OTG, North/South (vertical) poly orientation
- Ported to over 50 different processes and configurations ranging from 65-nm to 14/16-nm FinFET
- Supports the USB 2.0 protocol and data rate (480 Mbps)
- Supports the USB Type-C specification
- USB femtoPHY, USB nanoPHY and USB picoPHY offer a tunability feature that allows quick, post-silicon adjustments that occur due to process variations, or unexpected chip and board parasitic, without modifying the existing design
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USB 2.0 femtoPHY - TSMC 16FF+GL18 x1, OTG, North/South (vertical) poly orientation
- Ported to over 50 different processes and configurations ranging from 65-nm to 14/16-nm FinFET
- Supports the USB 2.0 protocol and data rate (480 Mbps)
- Supports the USB Type-C specification
- USB femtoPHY, USB nanoPHY and USB picoPHY offer a tunability feature that allows quick, post-silicon adjustments that occur due to process variations, or unexpected chip and board parasitic, without modifying the existing design
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USB-C 3.1/DP TX PHY for TSMC 16FFC, North/South Poly Orientation
- Part of a complete IP solution including xHCI host and device controllers, PHYs, verification IP, 1 IP Prototyping Kits and IP software development kits
- Designed for advanced 1.8V CMOS planar bulk and FinFET process nodes
- USB-C 3.1 PHY IP supports USB Type-C specification
- Supports the SuperSpeedPlus (10 Gbps) and SuperSpeed (5 Gbps) speed modes
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USB-C 3.1 SS/SSP PHY, Type-C - TSMC 16FFC, North/South Poly Orientation
- Part of a complete IP solution including xHCI host and device controllers, PHYs, verification IP, 1 IP Prototyping Kits and IP software development kits
- Designed for advanced 1.8V CMOS planar bulk and FinFET process nodes
- USB-C 3.1 PHY IP supports USB Type-C specification
- Supports the SuperSpeedPlus (10 Gbps) and SuperSpeed (5 Gbps) speed modes