Rambus Implements XDR Memory Interface in Ultra Low-Cost Package
Robust differential signaling enables 3.2 Gbps data rate for price-sensitive applications
DesignCon, San Jose, California, United States - February 3, 2009 -- Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announces the implementation of its award-winning XDR™ memory architecture using an ultra low-cost LQFP package. In a paper to be presented at DesignCon, Rambus will discuss the benefits of differential signaling delivering high memory bandwidth in a cost-effective package, ideal for consumer electronics such as set-top boxes and HDTVs.
“Today’s consumer electronics require high bandwidth and low-cost manufacturability,” said Martin Scott, senior vice president of Research and Technology Development at Rambus. “Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging.”
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on www.rambus.com.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' innovations and solutions enable unprecedented performance in computing, communications, and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as a range of leadership and industry-standard memory solutions. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.
DesignCon, San Jose, California, United States - February 3, 2009 -- Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announces the implementation of its award-winning XDR™ memory architecture using an ultra low-cost LQFP package. In a paper to be presented at DesignCon, Rambus will discuss the benefits of differential signaling delivering high memory bandwidth in a cost-effective package, ideal for consumer electronics such as set-top boxes and HDTVs.
“Today’s consumer electronics require high bandwidth and low-cost manufacturability,” said Martin Scott, senior vice president of Research and Technology Development at Rambus. “Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging.”
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on www.rambus.com.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' innovations and solutions enable unprecedented performance in computing, communications, and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as a range of leadership and industry-standard memory solutions. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
Related News
- Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs
- JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard
- 4DS Unveils New Interface Switching ReRAM Technology for Faster and Energy Efficient Memory for AI Processing
- Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver
Latest News
- Virtusa Acquires Bengaluru based SmartSoC Solutions, Establishing Full-Stack Service Offering from Chip to Cloud and Driving Expansion into the Semiconductor Industry
- Consumer Electronics and AI Product Launches Lift 3Q25 Top-10 Foundry Revenue by 8.1%, Says TrendForce
- Joachim Kunkel Joins Quadric Board of Directors
- RaiderChip NPU leads edge LLM benchmarks against GPUs and CPUs in academic research paper
- SEMIFIVE Secures AI Semiconductor Design Projects in Japan, Accelerating Global Expansion with New Local Subsidiary