TSMC Applies for 12-inch Wafer Fab and Design Service Center in China
Hsinchu, Taiwan, R.O.C. – December 7, 2015 - TSMC (TWSE: 2330, NYSE: TSM) today submitted an application to the Investment Commission of Taiwan’s Ministry of Economic Affairs for an investment project to build a wholly-owned 12-inch wafer manufacturing facility and a design service center in Nanjing, China.
The planned capacity of the facility is 20,000 12-inch wafers per month , and would be scheduled to begin volume production of 16nm process technology in the second half of 2018. The design service center is aimed at establishing TSMC’s design ecosystem in China. TSMC will commence the investment project upon receiving the approval from the Investment Commission.
“In view of the rapid growth of the Chinese semiconductor market, we have decided to establish a 12-inch wafer fab and a design service center in China to provide closer support to our customers there and to further expand our business opportunities,” said TSMC Chairman Dr. Morris Chang.
Related Semiconductor IP
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+
- TSMC CLN3FFP HBM4 PHY
Related News
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Why TSMC Wants to Build a 12-inch Wafer Fab in China
- Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
Latest News
- Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum
- EnSilica and Codasip announce strategic partnership
- Empower Semiconductor Secures Over $140M in Series D Financing
- Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation
- Euclyd Unveils CRAFTWERK: The World’s Most Power-Efficient Exascale Token Factory for Agentic AI