TSMC Applies for 12-inch Wafer Fab and Design Service Center in China
Hsinchu, Taiwan, R.O.C. – December 7, 2015 - TSMC (TWSE: 2330, NYSE: TSM) today submitted an application to the Investment Commission of Taiwan’s Ministry of Economic Affairs for an investment project to build a wholly-owned 12-inch wafer manufacturing facility and a design service center in Nanjing, China.
The planned capacity of the facility is 20,000 12-inch wafers per month , and would be scheduled to begin volume production of 16nm process technology in the second half of 2018. The design service center is aimed at establishing TSMC’s design ecosystem in China. TSMC will commence the investment project upon receiving the approval from the Investment Commission.
“In view of the rapid growth of the Chinese semiconductor market, we have decided to establish a 12-inch wafer fab and a design service center in China to provide closer support to our customers there and to further expand our business opportunities,” said TSMC Chairman Dr. Morris Chang.
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Why TSMC Wants to Build a 12-inch Wafer Fab in China
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
- Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
Latest News
- TSMC to Lead Rivals at 2-nm Node, Analysts Say
- Energy-efficient RF power modules developed using SOI technology
- Quintauris Demonstrates RISC-V Innovation in Automotive at CES
- UMC Reports Sales for December 2025
- Tenstorrent unveiled its first-generation compact AI accelerator device designed in partnership with Razer™ today at CES 2026