Why TSMC Wants to Build a 12-inch Wafer Fab in China
Peter Brown, IHS Electronics360
December 09, 2015
It is not a secret that the Chinese central government is investing heavily in the semiconductor industry and is supporting Chinese venture capital firms in their bid to acquire chip companies outside of the country. That means there is ample opportunity emerging in the country to take advantage of what promises to be a vast revenue expanse. That’s why Taiwan Semiconductor Manufacturing Corp. (TSMC) has plans to build its first 12-inch wafer fab in China after submitting an application to the Investment Commission of Taiwan’s Ministry of Economic Affairs.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- Allegro DVT Acquires Vicuesoft to Build a Worldwide Leader in Video Codecs Compliance and Analysis Solutions
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
- Huawei is hurrying to build a wafer fab
- Arm loses out in Qualcomm court case, wants a re-trial
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications