Why TSMC Wants to Build a 12-inch Wafer Fab in China
Peter Brown, IHS Electronics360
December 09, 2015
It is not a secret that the Chinese central government is investing heavily in the semiconductor industry and is supporting Chinese venture capital firms in their bid to acquire chip companies outside of the country. That means there is ample opportunity emerging in the country to take advantage of what promises to be a vast revenue expanse. That’s why Taiwan Semiconductor Manufacturing Corp. (TSMC) has plans to build its first 12-inch wafer fab in China after submitting an application to the Investment Commission of Taiwan’s Ministry of Economic Affairs.
To read the full article, click here
Related Semiconductor IP
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
- Radar IP
Related News
- Allegro DVT Acquires Vicuesoft to Build a Worldwide Leader in Video Codecs Compliance and Analysis Solutions
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
- Huawei is hurrying to build a wafer fab
- Arm loses out in Qualcomm court case, wants a re-trial
Latest News
- Premier ASIC and SoC Design Partner, Sondrel, Rebrands as Aion Silicon
- Intel Financial Risks, Layoffs, Foundry Ambitions
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- China Takes the Lead in RF Front-End Patent Activity: RadRock and Others Surge Behind Murata
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®