Why TSMC Wants to Build a 12-inch Wafer Fab in China
Peter Brown, IHS Electronics360
December 09, 2015
It is not a secret that the Chinese central government is investing heavily in the semiconductor industry and is supporting Chinese venture capital firms in their bid to acquire chip companies outside of the country. That means there is ample opportunity emerging in the country to take advantage of what promises to be a vast revenue expanse. That’s why Taiwan Semiconductor Manufacturing Corp. (TSMC) has plans to build its first 12-inch wafer fab in China after submitting an application to the Investment Commission of Taiwan’s Ministry of Economic Affairs.
To read the full article, click here
Related Semiconductor IP
- nQrux® Root of Trust IP
- AXI to UCIe Bridge IP
- UCIe 2.x Controller IP
- SWI3S (SoundWire I3S Interface) Peripheral Controller Core IP
- OpenTitan-based RISC-V Secure Element
Related News
- Analog Bits to Participate in a Customer Test Chip Tapeout on TSMC A14 and Present Papers with Cerebras, Arm and Socionext on Real-Time On-Chip Power Sensing and Delivery at 2026 TSMC Global OIP Ecosystem Events
- Huawei is hurrying to build a wafer fab
- A 10-cent RISC-V microcontroller from China? Why not?
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
Latest News
- JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
- Orthogone Technologies Launches Ultra-Low-Latency FPGA IP Portfolio for Multi-Industry Deterministic Networking
- TIER IV joins Arm Total Design for Physical AI to accelerate ready-to-use Autoware solutions through Open AD Kit
- SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
- ICTK to Acquire Network Security Firm withnetworks, Expanding from Security Chips into Global Enterprise Security Solutions