Toshiba and NEC Develop Key Technologies for High-Density MRAM
TOKYO, December 15, 2004 --- Toshiba Corporation and NEC Corporation today announced two key advancements toward development of a magnetoresistive random access memory, a technology seen as key to the development of future generations of high performance mobile equipment. Unveiling the latest fruits of a joint development program dating back to 2002, the two companies announced a new cell design that halves power consumption during data writes and cuts writing errors, and a novel MRAM architecture with high speed characteristics and a performance that will support development of high-density devices.
Full details of the new technology were presented on December 14 at IEDM (International Electron Devices Meeting) 2004 in San Francisco, USA.
The features of MRAM are fast read/write, high density, unlimited endurance and non-volatility?the ability to retain data when switched off. While MRAM show great promise for application in mobile information equipment, cell size and power consumption must be reduced, and no loss of operating speed achieved, before commercial application is possible. The advancements reported by NEC and Toshiba point the way forward.
NEC and Toshiba reduced write current by developing a new shape for the magnetic tunneling junction (MTJ) that stores information in the cell. The MTJ shape is similar to the standard rectangular shape, but with arc-shaped bulges on both sides, in the middle of the longer length. Seen from above, the outline of the shape resembles a coin placed on a rectangle. With this new design, write current is approximately half that of present MRAM, and writing errors are reduced, even if there is some fluctuation in the switching characteristics of each memory cell. (Please refer to the figure 1.)
Toshiba and NEC have also developed highly promising new cell architecture. Research to date has produced two basic proposals on MRAM cell structure. The first of these couples each cell with a transistor, which advances read times, but at a cost in increased cell size. The second, the cross point (CP) structure, removes the transistor from each individual cell, a move that reduces cell size, but read access time gets longer and read errors occur due to generation of sneak current, the tendency of current to be directed to the unselected cell. Toshiba and NEC have realized a high-speed CP cell structure that uses one transistor to control four cells. This achieves a cell that is the same size as a standard DRAM cell and conventional CP cell, and much smaller than an MRAM cell with transistor. (Please refer to figure 2.) The new architecture also achieves a 250 nanosecond read time, four times faster than the conventional CP cell structure.
Through continued joint development, Toshiba and NEC aim to define fundamental technologies required for realizing a 256 megabit MRAM, utilizing MTJ based on 250 nanometer design rule and CMOS technologies based on 130-180 nanometer design rules by fiscal year 2005.
Development of the new MRAM technologies was supported by grants from Japan's New Energy and Industrial Technology Development Organization (NEDO).
About Toshiba Corporation
Toshiba Corporation is a leader in the development and manufacture of electronic devices and components, information and communication systems, digital consumer products and power systems. The company's ability to integrate wide-ranging capabilities, from hardware to software and services, assure its position as an innovator in diverse fields and many businesses. In semiconductors, Toshiba continues to promote its leadership in the fast growing system-on-chip market and to build on its world-class position in NAND flash memories, analog devices and discrete devices. Visit Toshiba's website at www.toshiba.co.jp/index.htm
About NEC Corporation
NEC Corporation (NASDAQ: NIPNY) (FTSE: 6701q.l) is one of the world's leading providers of Internet, broadband network and enterprise business solutions dedicated to meeting the specialized needs of its diverse and global base of customers. Ranked as one of the world's top patent-producing companies, NEC delivers tailored solutions in the key fields of computer, networking and electron devices, by integrating its technical strengths in IT and Networks, and by providing advanced semiconductor solutions through NEC Electronics Corporation. The NEC Group employs more than 140,000 people worldwide and had net sales of 4,906 billion yen (approx. $47 billion) in the fiscal year ended March 2004. For additional information, please visit the NEC home page at: http://www.nec.com
***
Note:
1 nanosecond = one billionth of a second |
Figure 1.
Figure 2.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related News
- Toshiba Develops World's Highest-Bandwidth, Highest Density Non-Volatile RAM
- NEC Electronics and Toshiba Extend Chip Technology Development Agreements with IBM
- Actel drives up density of flash-based FPGAs
- Atmel Introduces New Embedded Memory Blocks to Support High Density FPGA Conversions
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers