Strategies for Addressing More Complex Custom Chip Design
By Abhishek Jadhav, EETimes | March 21, 2025
Unprecedented growth and demand for edge computing and high-performance computing (HPC) is creating new opportunities and significant challenges for custom chips. We spoke to Sondrel CEO Oliver Jones to discuss some of the approaches to addressing these needs.
Custom chip design is a multifaceted process involving many considerations, from power efficiency and performance trade-offs to manufacturing and packaging complexities. One of the primary challenges in this domain is managing power, performance and area (PPA) trade-offs.
Designers must carefully balance these factors to ensure that the final product meets the strict requirements of modern applications like AI at the edge or HPC workloads. Additionally, the process involves navigating geopolitical disruptions and supply chain constraints, which can delay production and increase costs.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- sureCore extends its sureFIT design service to include custom memory solutions for AI applications
- sureCore extends its sureFIT design service to include custom memory solutions for AI applications
- ICE-G3 EPU Adds Cluster Controller to Save More Energy For Complex Chip Power Architectures
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack