Simplifying the Analog and Mixed-Signal IC Design Process
By Maurizio Di Paolo Emilio, EEWeb (June 14, 2023)
Analog and mixed-signal (AMS) circuit design typically involves designing components like amplifiers, filters and data converters, which can be complex and time-consuming, often requiring manual design expertise and iterations.
This article is focused on the revolutionary approach to the design of AMS circuits developed by Agile Analog. This U.K.-based semiconductor company simplifies and accelerates this process with its scalable platform.
By automating parts of the design process, Agile Analog makes the analog design more accessible to a broader range of engineers, including those without extensive expertise in analog circuit design. The main goal is to enable faster and more reliable development of analog ICs, crucial for various applications, including telecommunications, automotive, consumer electronics and internet-of-things devices.
To read the full article, click here
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- Thalia enhances AMALIA Platform with new AI models to revolutionize analog, RF and mixed-signal IC design migration
- Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite
- Agile Analog announces MoU to support new Southern Taiwan IC Design Industry
- Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications