Qualcomm Vets Join Blockchain RISC-V Chip Developer
Nitin Dahad, EETimes
8/1/2018 00:01 AM EDT
LONDON — An organization developing what it claims is the world’s first blockchain chip and a network of hyper-scalable blockchain IoT networks to create an “intelligent machine economy” has taken on a number of former Qualcomm engineers to develop the chip and the ecosystem.
The Skynet project, launched by the OpenSingularity Foundation, envisions a network of intelligent machines (as in the movie “Terminator”), utilizing blockchain, IoT, and AI to create secure trusted networks of devices that can intelligently communicate with each other autonomously and on a large scale. The organization says that this will enable billions of interconnected identifiable IoT devices to participate effortlessly in a global machine-to-machine (M2M) economy powered by self-organizing AI networks with data integrity facilitated by blockchains, which provide solutions for device identity, secure decentralized micro-payments, and trusted communication.
To read the full article, click here
Related Semiconductor IP
- All-In-One RISC-V NPU
- Configurable RISC-V processor IP core
- MIPI I3C Master RISC-V based subsystem
- ISO26262 ASIL-B/D Compliant 32-bit RISC-V Core
- RISC-V CPU IP
Related News
- Andes, HiRain, and HPMicro Join Hands to Build RISC-V AUTOSAR Software Ecosystem
- VyperCore plans 5nm RISC-V server chip and card
- InCore Unveils Six-Core RISC-V Test Chip To Accelerate Design Adoption
- Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale