PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys’ Next-Generation Interface and Memory IP on Advanced Nodes
November 13, 2025 -- As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid escalating design complexity. Emerging architectures built around UCIe-based chiplets, PCI Express 7.0 and CXL 3.1 interconnects, and 2.5D / 3D memory-integrated packaging have made integration—not computation—the new bottleneck. Progate Group Corporation (PGC, TPEx: 8227), a member of TSMC DCA, leverages its long-term partnership with Synopsys to solve that bottleneck. Through a unified ASIC turnkey flow, PGC enables innovators to design, verify, and manufacture advanced-node SoCs and chiplet-based accelerators for cloud and AI applications with greater efficiency and lower risk.
Bridging the Bandwidth Wall with Proven Interface IP
PGC integrates the latest generation of Synopsys Interface IP, spanning high-speed interconnects, memory, and networking subsystems critical to modern cloud and AI processors. The portfolio includes UCIe 40G Die-to-Die, CXL 3.x, and PCI Express 7.0 controllers that enable seamless chiplet-based compute integration for next-generation server processors. It also incorporates HBM4 and DDR5 Gen2 memory subsystems optimized for multi-stack 2.5D and 3D integration, as well as 224G Ultra Ethernet PHY solutions designed for high-throughput data-center networking. Validated across TSMC 3 nm to 2 nm process nodes, these silicon-proven IPs address the cloud industry’s most demanding bandwidth and power-efficiency challenges while maintaining full compatibility with Synopsys EDA and PDK environments.
End-to-End Turnkey Integration on TSMC Advanced Nodes
Through its TSMC Design Center Alliance (DCA) membership, PGC provides a verified turnkey service covering RTL design, APR layout, wafer fabrication, 2.5D / 3D packaging, and final test coordination. By integrating Synopsys EDA tools (Design Compiler, Fusion Compiler, ICC2, PrimeTime) and complete IP deliverables (Lib, LEF, GDS, and testbench models), PGC helps customers accelerate RTL-to-signoff cycles through pre-verified IP subsystems, SIPI (signal and power integrity) analysis, and IP hardening support—as described in Synopsys’ IP Accelerated methodology. This unified approach reduces integration risk, minimiclozes manual iteration, and ensures design closure consistency across advanced-node ASIC projects.
“Cloud and AI systems are evolving into distributed compute platforms built on multiple dies and protocol layers,” said Fred Lai, CEO of PGC. “By aligning Synopsys’ IP Accelerated methodology with TSMC’s leading-edge processes, PGC helps customers scale performance while maintaining design predictability and manufacturing reliability.”
Why PGC: Scalable Expertise for a Distributed Silicon Era
Unlike large turnkey providers that concentrate solely on a handful of mega-scale clients, PGC combines advanced-node design capability with engineering agility, making it a trusted partner for both hyperscalers and rapidly growing AI startups.
Beyond simplifying multi-vendor coordination, the company maintains unified technical accountability across design, IP integration, and manufacturing, ensuring that every stage of development proceeds seamlessly.
PGC’s engineers perform SIPI co-optimization using Synopsys EDA and PDK models to guarantee signal and power stability, while TSMC-certified signoff flows deliver predictable yield and reliability. Supported by cross-regional teams in Taiwan, Japan, China, and the United States, PGC provides rapid collaboration and execution across the entire ASIC turnkey cycle.
An Ecosystem Built for the Future of Cloud Compute
PGC’s ecosystem extends from design integration to manufacturing, combining TSMC’s advanced-node foundry services, Synopsys’ comprehensive IP portfolio, and partnerships with leading OSAT partners for 2.5D / 3D packaging enablement. Together, this network provides a complete foundation for high-bandwidth, energy-efficient ASIC innovation across AI, HPC, and cloud computing markets.
About Progate Group Corporation (PGC)
Progate Group Corporation (TPEx: 8227) is a Taiwan-based ASIC design and turnkey service provider offering full-spectrum support from RTL to GDSII, wafer fabrication, packaging, and testing.
As a TSMC Design Center Alliance member and Synopsys IP OEM Partner, PGC delivers silicon-proven solutions for AI, HPC, and cloud computing applications, combining advanced-node expertise with cross-regional collaboration.
For more IP information, visit: https://www.pgc.com.tw
Related Semiconductor IP
- UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
- CXL 3.0 Integrity and Data Encryption Security Module
- PCIe 7.0 PHY, TSMC N3P x4, North/South (vertical) poly orientation
- TSMC CLN3FFP HBM4 PHY
- DDR5 PHY - TSMC N3P
Related News
- Cadence Introduces Industry-First LPDDR6/5X 14.4Gbps Memory IP to Power Next-Generation AI Infrastructure
- Xilinx Launches Industry's First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers
- Xilinx Announces World's Highest Bandwidth, Highest Compute Density Adaptable Platform for Network and Cloud Acceleration
- First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced
Latest News
- PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys’ Next-Generation Interface and Memory IP on Advanced Nodes
- IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter-Ready SoCs
- VeriSilicon and Google Jointly Launch Open-Source Coral NPU IP
- proteanTecs Appoints Noritaka Kojima as GM & Country Manager and Opens New Japan Office
- QuickLogic Reports Fiscal Third Quarter 2025 Financial Results