NXP Goes All In on FD-SOI
Junko Yoshida, EETimes
3/15/2017 01:26 PM EDT
PARIS – To do FD-SOI or not to do FD-SOI? NXP Semiconductors’ announcement this week at Embedded World in Nuremberg might finally put an end to this Shakespearean quandary, although there remain players in the chip industry unprepared to face the answer.
NXP launched what the company claims to be the lowest power general-purpose applications processors – dubbed i.MX 7ULP – yet developed for IoT applications.
According to NXP, the i.MX 7ULP design delivers a deep-sleep suspended power consumption of 15 uW or less, 17 times better than its previous low-power i.MX 7 devices. The dynamic power efficiency is improved by 50 percent in the real-time domain.
To read the full article, click here
Related Semiconductor IP
- MIPI D-PHY Transmitter/Receiver for DSI/CSI-2 on Samsung 28nm FD-SOI
- Samsung 28nm FDSOI 1.8v/1.0v LVDS Transmitter
- General Purpose Temperature Sensor - 2°C accuracy – 10-bit Digital Readout - Globalfoundries 22nm FD-SOI
- USB3.0 PHY on GF22FDX and Samsung 28nm FDSOI
- GLOBALFOUNDRIES 22nm FDSOI USB3.0 PHY
Related News
- NXP Embraces 28nm FDSOI for MCUs
- NXP Taps into FD-SOI Technology to Enable the Industry's Lowest Power General Purpose Applications Processors
- NXP Delivers Industry's First ARM Cortex-M0 Microcontrollers with Integrated USB Drivers
- NXP Ships World's Fastest ARM Cortex-M4 and Cortex-M3 Microcontrollers
Latest News
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
- QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program