NXP Goes All In on FD-SOI
Junko Yoshida, EETimes
3/15/2017 01:26 PM EDT
PARIS – To do FD-SOI or not to do FD-SOI? NXP Semiconductors’ announcement this week at Embedded World in Nuremberg might finally put an end to this Shakespearean quandary, although there remain players in the chip industry unprepared to face the answer.
NXP launched what the company claims to be the lowest power general-purpose applications processors – dubbed i.MX 7ULP – yet developed for IoT applications.
According to NXP, the i.MX 7ULP design delivers a deep-sleep suspended power consumption of 15 uW or less, 17 times better than its previous low-power i.MX 7 devices. The dynamic power efficiency is improved by 50 percent in the real-time domain.
To read the full article, click here
Related Semiconductor IP
- USB3.0 PHY on GF22FDX and Samsung 28nm FDSOI
- 12-bit, 4 GSPS High Performance IQ ADC in 22nm FD-SOI
- LDO With ULP Ludicrous Mode - GLOBALFOUNDRIES 22nm FDSOI
- Low Power RC Oscillator on Globalfoundries 22nm FDSOI
- GLOBALFOUNDARIES 22nm FDSOI LVDS Transceiver Pad
Related News
- NXP Embraces 28nm FDSOI for MCUs
- NXP Taps into FD-SOI Technology to Enable the Industry's Lowest Power General Purpose Applications Processors
- NXP Shows First FD-SOI Chips
- NXP Develops Automotive Ethernet Transceivers for In-Vehicle Networks
Latest News
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations