NXP Embraces 28nm FDSOI for MCUs
Peter Clarke, EETimes
1/18/2016 04:10 PM EST
PARIS—NXP is set to extend the use of 28nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.
Lees was speaking at an event to intended to emphasize that the enlarged NXP, after its merger with Freescale, is well place to offer processers, security and software for the Internet of Things in all of its various vertical applications, whether in the consumer, industrial, medical or automotives sectors.
To read the full article, click here
Related Semiconductor IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
Related News
- NXP Taps into FD-SOI Technology to Enable the Industry's Lowest Power General Purpose Applications Processors
- NXP Goes All In on FD-SOI
- NXP Delivers Industry's First ARM Cortex-M0 Microcontrollers with Integrated USB Drivers
- NXP Ships World's Fastest ARM Cortex-M4 and Cortex-M3 Microcontrollers
Latest News
- AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms
- Security in the Quantum Era: From Cryptography to Trust — ICTK Introduces a Hardware Trust Foundation for the Quantum Era
- TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
- Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027