IBM Demos III-V FinFETs on Silicon
CMOS Compatible Process for Advanced Nodes
R. Colin Johnson, EETimes
6/18/2015 10:20 PM EDT
PORTLAND, Ore.--The entire semiconductor industry is trying to find a way to exploit the higher electron mobility of indium, gallium and arsenide (InGaAs) without switching from silicon substrates, including the leaders at Intel and Samsung. IBM has demonstrated how to achieve this with standard CMOS processing.
Last month IBM showed a technique of putting III-V compounds of InGaAs onto silicon-on-oxide (SOI) wafers, but now a different research group claims to have found an even better way that uses regular bulk-silicon wafers and have fabricated the InGaAs-on-silicon FinFETs to prove it.
"Starting from a bulk silicon wafer, instead of SOI, we first put down an oxide layer and make a trench through to the silicon below, then grow the indium gallium arsenide from that seed--its a very manufacturable process," Jean Fompeyrine, manager of advanced functional materials told EE Times. Fompeyrine performed the work with Lukas Czornomaz, an advanced CMOS scientist with IBM Research.
To read the full article, click here
Related Semiconductor IP
- UCIe Chiplet PHY & Controller
- MIPI D-PHY1.2 CSI/DSI TX and RX
- Low-Power ISP
- eMMC/SD/SDIO Combo IP
- DP/eDP
Related News
- Intel, IBM Dueling 14nm FinFETS
- zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
- Think Silicon and Edge Impulse Democratize ML on NEOX® for Wearables and AIoT
- HCLTech and Arm collaborate on custom silicon chips optimized for AI workloads
Latest News
- Frontgrade Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications
- Digital Core Design Unveils DPSI5 - The Next-Generation IP Core for PSI5 Communication
- Matrox Video and intoPIX Expand Interoperable IPMX & ST 2110 Solutions with JPEG XS Innovation at NAB 2025
- HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner
- TeraSignal to Showcase Retimer-Less PCIe 6.0 over Optics Featuring Synopsys IP at OFC 2025