Intel, IBM Dueling 14nm FinFETS
IEDM reveals diametrically opposed approaches
R. Colin Johnson, EETimes
10/21/2014 06:26 PM EDT
PORTLAND, OR — Every digital semiconductor manufacturer and foundry in the world is trying to build 3D FinFETS that rival Intel, which is so far leading the pack by several years. Hot on Intel's heels is IBM, which just signed a deal to turn its fabs over to GlobalFoundries (which has already licensed Samsung's FinFET process that, according to Rick Doherty, research director of The Envisioneering Group, told EE Times stems from early IBM/GlobalFoundaries discussions). TSMC, AMD, Freescale, and others claim to be hot on Intel's and IBM's trail, but have yet to prove it.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
Related News
- Cadence Announces Tapeout of 14nm Test-chip with ARM Processor and IBM FinFET Process Technology
- IBM Demos III-V FinFETs on Silicon
- GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems
- Rambus Announces IBM to License Multi-protocol Serdes
Latest News
- Virtusa Acquires Bengaluru based SmartSoC Solutions, Establishing Full-Stack Service Offering from Chip to Cloud and Driving Expansion into the Semiconductor Industry
- Consumer Electronics and AI Product Launches Lift 3Q25 Top-10 Foundry Revenue by 8.1%, Says TrendForce
- Joachim Kunkel Joins Quadric Board of Directors
- RaiderChip NPU leads edge LLM benchmarks against GPUs and CPUs in academic research paper
- SEMIFIVE Secures AI Semiconductor Design Projects in Japan, Accelerating Global Expansion with New Local Subsidiary