Intel, IBM Dueling 14nm FinFETS
IEDM reveals diametrically opposed approaches
R. Colin Johnson, EETimes
10/21/2014 06:26 PM EDT
PORTLAND, OR — Every digital semiconductor manufacturer and foundry in the world is trying to build 3D FinFETS that rival Intel, which is so far leading the pack by several years. Hot on Intel's heels is IBM, which just signed a deal to turn its fabs over to GlobalFoundries (which has already licensed Samsung's FinFET process that, according to Rick Doherty, research director of The Envisioneering Group, told EE Times stems from early IBM/GlobalFoundaries discussions). TSMC, AMD, Freescale, and others claim to be hot on Intel's and IBM's trail, but have yet to prove it.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- MIPI SoundWire I3S Peripheral IP
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
- LPDDR6/5X/5 Controller IP
- Post-Quantum ML-KEM IP Core
Related News
- Cadence Announces Tapeout of 14nm Test-chip with ARM Processor and IBM FinFET Process Technology
- IBM Demos III-V FinFETs on Silicon
- GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems
- Rambus Announces IBM to License Multi-protocol Serdes
Latest News
- ADTechnology Collaborates with Euclyd to Develop Ultra-Efficient AI Chip for Datacenters
- SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles
- PUFsecurity’s PUFrt Anchors the Security of Silicon Labs’ SoC to Achieve the Industry’s First PSA Certified Level 4
- The next RISC-V processor frontier: AI
- PQShield joins EU-funded FORTRESS Project: Pioneering Quantum-Safe Secure Boot for Europe’s Digital Future