Intel, IBM Dueling 14nm FinFETS
IEDM reveals diametrically opposed approaches
R. Colin Johnson, EETimes
10/21/2014 06:26 PM EDT
PORTLAND, OR — Every digital semiconductor manufacturer and foundry in the world is trying to build 3D FinFETS that rival Intel, which is so far leading the pack by several years. Hot on Intel's heels is IBM, which just signed a deal to turn its fabs over to GlobalFoundries (which has already licensed Samsung's FinFET process that, according to Rick Doherty, research director of The Envisioneering Group, told EE Times stems from early IBM/GlobalFoundaries discussions). TSMC, AMD, Freescale, and others claim to be hot on Intel's and IBM's trail, but have yet to prove it.
To read the full article, click here
Related Semiconductor IP
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
- JESD204E Controller IP
Related News
- Cadence Announces Tapeout of 14nm Test-chip with ARM Processor and IBM FinFET Process Technology
- IBM Demos III-V FinFETs on Silicon
- GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems
- IBM, Synopsys Move Toward 1.4-nm Node with Heat-Modeling Tech
Latest News
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
- QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program
- Cadence Reports Fourth Quarter and Fiscal Year 2025 Financial Results
- Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs