IBM, Chartered and Samsung Extend Integrated DFM Support for Common Platform Technology to 45nm
--As the Common Platform(TM) technology alliance, IBM, Chartered Semiconductor Manufacturing and Samsung Electronics, Co., Ltd. today announced the availability of design-for-manufacturing (DFM) technology models, data files and design kits from leading EDA and DFM companies, supporting Common Platform technology at 45 nanometer (nm). This is the second node, following 65nm, where the alliance partners have driven comprehensive DFM solutions, which marry technology and tool support from leading EDA and DFM suppliers with manufacturing data and models from the Common Platform technology foundries to help ensure the success of chip designs at this advanced technology node across all three manufacturers' fabs.
The Common Platform technology alliance is exhibiting this week in booth #2460 at the 44th annual Design Automation Conference in San Diego, Calif.
"Our goal is to enable our customers to make informed decisions about design tradeoffs which for today's leading-edge technologies include manufacturability," said Ana Molnar Hunter, vice president of technology, Samsung Semiconductor, Inc. "At 45nm, DFM is integral in linking design, process flow, and manufacturing, giving designers more control and predictability over the outcome for robust variation-aware designs."
The 45nm DFM offering for Common Platform technology supports a wide range of capabilities, which address the critical manufacturing-related issues from design to mask making. While continuing to support existing capabilities from multiple companies previously announced at 65nm, the Common Platform companies have enabled additional tools, including DFM tools from Mentor Graphics that perform critical area analysis (CAA) and critical feature analysis (CFA) and a silicon-validated CMP Predictor from Cadence Design Systems.
The move to 45nm requires even greater cooperation across multiple tool suppliers, and to address this challenge and better serve customers, the Common Platform companies are driving unprecedented industry collaboration and integration of design solutions and are demonstrating cross-vendor tool integration at DAC.
About the Common Platform
IBM, Chartered and Samsung Electronics have broken new ground in the semiconductor industry with a unique collaboration focused on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is further supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP and design services industries. This ecosystem allows foundry customers to source their chip designs to multiple 300mm foundries with minimal design work, unprecedented flexibility and choice. The Common Platform model features 90nm, 65nm, 45nm and 32nm technologies. For more information on the Common Platform, visit www.commonplatform.com.
About IBM
For more information about semiconductors, please visit www.ibm.com/chips.
About Chartered
Chartered Semiconductor Manufacturing (Nasdaq:CHRT - News; SGX-ST:CHARTERED), one of the world's top dedicated semiconductor foundries, offers leading-edge technologies down to 65 nanometer (nm), enabling today's system-on-chip designs. The company further serves the needs of customers through its collaborative, joint development approach on a technology roadmap that extends to 32nm. Chartered's strategy is based on open and comprehensive design enablement solutions, manufacturing enhancement methodologies, and a commitment to flexible sourcing. In Singapore, the company operates a 300mm fabrication facility and four 200mm facilities. Information about Chartered can be found at www.charteredsemi.com.
About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2006 parent company sales of US$63.4 billion and net income of US$8.5 billion. Employing approximately 138,000 people in over 124 offices in 56 countries, the company consists of five main business units: Digital Media Business, LCD Business, Semiconductor Business, Telecommunication Network Business and Digital Appliance Business. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs. For more information, please visit www.samsung.com.
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 10-bit Pipeline ADC - Tower 180 nm
- Simulation VIP for Ethernet UEC
- CAN-FD Controller
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
Related News
- Chartered, IBM and Samsung Announce Availability of DFM Support for Common Platform 65nm Technology
- IBM, Samsung Unveil VTFET to Extend Moore's Law
- Andes and Arculus System Collaborate to Integrate iPROfiler™ into AndeSysC, Expanding Virtual Platform Support for RISC-V SoC Design
- Samsung Joins IBM and Chartered on 90-Nanometer Common Design-Enablement Platform
Latest News
- Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025
- WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS
- Quintauris releases RT-Europa, the first RISC-V Real-Time Platform for Automotive
- PQShield's PQCryptoLib-Core v1.0.2 Achieves CAVP Certification for a broad set of classical and post-quantum algorithms
- M31 Debuts at ICCAD 2025, Empowering the Next Generation of AI Chips with High-Performance, Low-Power IP