New design techniques enable extremely reliable medical devices
Dresden, March 12, 2012 - For pacemakers and other implantable medical devices there are three key factors: extreme reliability, small size, and long longevity. In the EU project DeSyRe, researchers tackle these issues with a new approach: building a reliable system on unreliable components. Ioannis Sourdis, project leader, today explains the DeSyReâs approach in a tutorial on âHardware and software design and verification for safety critical electronic systemsâ during the DATE 2012 conference in Dresden.
To counter the increasing fault-rates expected in the next technology generations, DeSyRe develops new design techniques for future Systems-on-Chips to improve reliability while at the same time reducing power and performance overheads associated with fault-tolerance. Ioannis Sourdis, Assistant Professor in Computer Engineering at Chalmers University of Technology, is the project leader of DeSyRe (on-Demand System Reliability).
âWe focus on the design of future highly reliable Systems-on-Chips that consume far less power than other designs for high reliability systems,â he says. âThis approach allows by design devices that combine high reliability with small batteries and state-of-the-art longevity. It is perfect for safety-critical applications such as in implantable medical devices, for example pacemakers or deep brain stimulators that treat Parkinsonâs diseaseâ.
Research in reliable systems typically focuses on fail-safe mechanisms that use various redundancy schemes, in which sensitive subsystems are entirely doubled as a fail-safe. Checking for faults in the subsystem increases the energy consumption and decreases the performance of chips, as testing all subsystems cost time and energy.
The DeSyRe consortium takes a different approach, and separates the System-on-Chip (SoC) into two different areas: one which is extremely resistant to faults, and one area with fault-prone processing cores. The cores on the fault-prone area are interchangeable and the task of one core can easily be transferred to any of the other cores in case of a diagnosed malfunction. The fault-free part of the chip is responsible for monitoring the operation of the fault-prone part by performing sanity-checks of the processing cores, and for assuring that each core correctly handles an assigned sub-task.
âIt sounds perhaps counterintuitive to design a highly reliable System-on-Chip on the basis of components that may fail, and yet this is exactly what we propose to do. Since our subsystems consist of small, interchangeable processing cores, we can test and exclude individual cores while the function of the whole systems stays intactâ, says Gerard Rauwerda, CTO of Recore Systems, one of the industry partners of DeSyRe. "The beauty of the DeSyRe approach is that the system continues to do its job reliably, even if one or more cores fail, extending chip longevity."
The researchers expect this type of fault-tolerance to reduce energy consumption by at least ten to twenty percent compared to other redundancy schemes, while at the same time minimizing penalty on performance.
"People that need implantable medical devices will also benefit from this, as it pays off in a longer battery life and a postponed device replacement without any compromise to reliability," Ioannis Sourdis concludes.
About the tutorial at DATE 2012
The tutorial on âHardware and software design and verification for safety critical electronic systemsâtakes place on Monday March 12, from 09:30 to 13:00, during the DATE 2012 Conference in Dresden.
More on the DATE 2012 âDesign Automation and Test in Europeâ conference and the tutorial: www.date-conference.com/conference/session/E1
About the EU FP7 project DeSyRe
The DeSyRe consortium brings together leading European experts in the field of fault-tolerant and self-repairing designs, both from academia and industry. University partners are: project leader Chalmers University of Technology (Sweden), University of Bristol (UK), EPFL (Switzerland), FORTH (Greece) and Imperial College London (UK). Industry partners are Neurasmus and Recore Systems (The Netherlands) and Yogitech (Italy).
Project start date: 1st October 2011
Duration: 36 months
Project website: www.desyre.eu
For more information, please contact:
Ioannis Sourdis, Chalmers University of Technology, +46 31 772 17 44, sourdis@chalmers.se
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Siemens accelerates integrated circuit design and verification with agentic AI in Questa One
- MIPS and Green Hills Software Accelerate Safety Certified Product Development for MIPS RISC-V Microcontrollers
- TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
- Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs