Gowin Semiconductor Brings Ultra Low Power Programmable Logic Devices To Market
San Jose, CA and Guangzhou, China, October 29, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, introduces its latest family of small size and low power FPGA products, the GW1NZ “Mobile FPGA”. Using proprietary design techniques and the latest in ultra-low power processes, GOWIN continues to add value to mobile and wearable applications through the development of its innovative FPGA solutions.
Today, mobile and wearable applications are pushing the limits on power usage, especially where the size of devices are causing batteries to get smaller. Yet end users are wanting better battery efficiency to reduce their charging time. GOWIN addresses these concerns with the GW1NZ “Mobile FPGA.” Based on it CoolSmart® technology and TSMC’s 55nm Ultra Low Power Embedded FLASH process, GOWIN delivers an ultra-low power, small size, and cost-effective FPGA solution targeted for these mobile and wearable applications.
"Mobile and wearable device manufacturers are struggling to get the best power efficiency out of their products,” said Scott Casper, Director of Sales, Americas. “The Mobile FPGA allows these manufacturers to further stretch the power limits of their designs with a small size and cost-effective solution. We believe the GW1NZ Mobile FPGA is the first of its kind offering a cost comparable alternative to off the shelf MCU’s or ASIC’s but running faster and more efficient.”
Available in a 16-ball 1.8mm x 1.8 mm WLCSP package, the GW1NZ “Mobile FPGA” includes GOWIN’s CoolSmart® Technology, enabling a standby power below 10uW (ZV device). It will also feature MIPI I3C and MIPI SPMI master and slave hardcore IP for direct connection to other MIPI compliant devices. The first offering will be a 1K LUT device; more sizes and package options are forthcoming.
Device programming is accomplished with GOWIN’s proprietary toolchain. In addition, a complete library of IP cores and reference designs are available to assist in developing platform solutions. All of these resources are available for download on GOWIN’s website, www.gowinsemi.com. The GW1NZ-LV1 (1.2V core VCC) device is in production today.
The GW1N-ZV1 (0.9V core VCC) samples will be available in early 2019. Please contact your local sales person or distributor for further details.
About GOWIN Semiconductor Corp.
Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com
Related Semiconductor IP
- Temperature Glitch Detector
- Clock Attack Monitor
- SoC Security Platform / Hardware Root of Trust
- SPI to AHB-Lite Bridge
- Octal SPI Master/Slave Controller
Related News
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- Gowin Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability
- GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products
- GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing