Huawei planning on using SMIC to fab 7nm ICs this year
By David Manners, Electronics Weekly (July 31, 2023)
Huawei plans to fab 5G chips on a 7nm process at SMIC this year, reports the Nikkei.
The chips are not expected to be in phones on the market until next year.
To read the full article, click here
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Huawei Launches Kirin 980, the World's First Commercial 7nm SoC
- Apple, Huawei Use TSMC, But Their 7nm SoCs Are Different
- SMIC Graduating from 14nm to Something Sort of Akin to 7nm
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale